WMSIC Electronic Components

BORN SMD1206-050/30N

ModelSMD1206-050/30N
Package1206
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD1206-050 / 30N
Type
BORN
Minimum package
3500 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD1206-050/30N
Electronic Component
1
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.04g
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0257674548
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
30V
Power(Pd)
600mW
Current(Imax)
100A
Electronic Component
Electronic Component
Electronic Component
3500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206-050/30N 产品概述

一、产品简介

SMD1206-050/30N(品牌:BORN 伯恩半导体)为1206贴片封装的保护元件,常用作电路短路/过流保护的熔断器/保险丝件。器件设计用于在异常电流条件下迅速动作,保护后端负载与线路,适合对空间和自动化贴装有要求的表面贴装(SMT)应用。

二、主要技术参数

  • 最大耐压(Vmax):30 V
  • 最大承受电流(Imax,冲击/短时):100 A
  • 保持电流(Ihold):500 mA(正常长期工作电流上限参考值)
  • 跳闸电流(Itrip):1 A(达到此值器件在约100 ms 动作)
  • 动作时间:约 100 ms(典型)
  • 功耗(Pd):600 mW(稳态额定功耗)
  • 初始态阻值(Rmin):150 mΩ(上电前低阻态)
  • 跳断后阻值(R1max):1 Ω(动作后隔离电阻上限)
  • 工作温度范围:-40 ℃ 至 +85 ℃
  • 封装:1206(标准 SMD 尺寸,便于自动化贴装)

三、性能特点

  • 小封装、节省空间,适合高密度 PCB 布局;
  • 快速响应(约 100 ms)以限制短路能量,保护下游器件;
  • 低初始阻值(≈150 mΩ),对正常工作电压降影响小;
  • 动作后阻值显著上升(≤1 Ω),能有效切断过流路径;
  • 支持高瞬时冲击电流(最高可达 100 A),对浪涌事件具有一定承受能力;
  • 宽温区工作(-40~+85 ℃),适应常见民用与工控环境。

四、典型应用

  • 手机、平板、便携设备及其充电电路的过流保护;
  • USB/外设接口、数据线和通信端口保护;
  • LED 驱动、开关电源与电源输入端的短路防护;
  • 工业控制板、电池管理初级保护(非主动力电池保护,需按系统级规范选型);
  • 任何需要在有限板面上实现可靠过流保护的场合。

五、选型与使用建议

  • 工作电流选型时,正常最大工作电流应低于 Ihold,并留有裕量以防温升影响;
  • 评估系统中的浪涌/启动电流是否会超过 Itrip 或 Imax,必要时在前端添加限流或缓启动电路;
  • 布局时保持器件周围散热通道,避免靠近高温元件导致误动作;
  • 按制造商推荐的焊接及回流曲线进行 SMT 贴装,避免过高回流峰值温度或过长高温停留;
  • 对安全/可靠性有严格要求的系统,建议参考厂方完整数据手册并做实测验证。

六、储存与可靠性注意

  • 建议保持原包装储存,防潮防尘;长期储存前检查包装状态和环境条件;
  • 贴装与测试过程中避免机械应力与重复弯折;
  • 如需用于重要安全回路,请结合系统冗余与失效模式分析(FMEA)作整体设计。

七、总结

SMD1206-050/30N 是一款适用于表面贴装场景的小型过流保护器件,具有响应快、初始阻抗低、能承受短时高冲击电流等特点。选型与布局需综合考虑工作电流、冲击能量及环境温度,详细规范与可靠性数据应以厂方数据手册为准,以确保在目标应用中的安全与长期稳定性。

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