WMSIC Electronic Components

BORN SMD1206-200/16N

ModelSMD1206-200/16N
Package1206
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMD1206-200 / 16N
Type
1206
Minimum package
3500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMD1206-200/16N
Electronic Component
1
Electronic Component
1.8mm
Package
1206
Electronic Component
Resettable Fuse
Electronic Component
0.045g
Electronic Component
3.4mm
Electronic Component
1.3mm
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0264897303
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
800mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMD1206-200/16N 产品概述

一、概述

SMD1206-200/16N 为 BORN(伯恩半导体)推出的 1206 封装可恢复自恢复保险丝(PPTC),额定保持电流 2A,额定耐压 16V。器件尺寸为 3.4mm × 1.8mm × 1.3mm,适用于空间受限的表贴电路板,为电源线、USB、便携设备和板级保护提供重复保护功能。

二、主要参数

  • 额定耐压 (Vmax):16V
  • 最大电流 (Imax):40A(瞬态或短路条件下的最大承受值)
  • 保持电流 (Ihold):2A(器件在不动作时能长期承受的电流)
  • 跳闸电流 (Itrip):4A(在标准条件下触发动作的典型电流)
  • 消耗功率 (Pd):800mW(在 25°C 附近的最大功耗)
  • 初始态阻值 (Rmin):18mΩ(冷态低阻,影响压降)
  • 跳断后阻值 (R1max):100mΩ(动作后限制电流的高阻)
  • 动作时间:500ms(在指定过流条件下的参考动作时间)
  • 工作温度:-40°C ~ +85°C
  • 封装:1206(SMD),尺寸 3.4 × 1.8 × 1.3 mm
  • 品牌:BORN(伯恩半导体)

三、工作原理与关键术语说明

该器件为聚合物正温度系数(PPTC)自恢复保险丝。正常工作时呈低电阻(Rmin),通过较小电压产生最小发热;当电流超过 Itrip 或在高于指定时间累积能量时,器件内部加热使电阻迅速上升至跳断后阻值(R1max),从而限制故障电流。故障消除并冷却后可自动恢复到初始低阻态。Ihold 与 Itrip 的选择需参考环境温度与 PCB 热散条件。

四、典型应用场景

  • USB 供电保护(便携设备、外设)
  • 电池供电设备与电源管理模块的短路/过流保护
  • LED 驱动器与小功率电源轨保护
  • 家电控制板、工业控制板的板级保护(非高温发动机舱)

注意:工作温度上限为 +85°C,若用于高温环境需做额外热管理或选用更高温等级器件。

五、封装与安装建议

  • 与标准 1206 焊盘兼容,建议采用常规 SMT 回流焊工艺(请遵循厂商回流曲线,避免长时间超过峰值温度)。
  • PCB 布局时注意周围铜箔面积与散热环境会显著影响动作电流与时间:大铜箔有利散热会提高动作电流/延长动作时间。
  • 留足电气间距与机械空间以利于散热和避免邻近元件受热影响。

六、可靠性与使用注意事项

  • 选型时建议给予 20%~50% 电流裕度,避免长期在靠近 Ihold 的边界工作以延长寿命。
  • 测试时务必在目标应用的真实温度和 PCB 条件下验证 Ihold 与 Itrip。
  • 避免在超过规范的持续过载下使用,防止不可逆损坏。存储环境应干燥、避免强光与高温潮湿。

七、订购信息

型号:SMD1206-200/16N
品牌:BORN(伯恩半导体)
封装:1206,2A 保持电流,16V 耐压。请联系供应商获取最新数据手册、回流焊曲线以及批量订购与认证信息。

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