WMSIC Electronic Components

BORN 1.5SMBJ58CA

Model1.5SMBJ58CA
PackageSMB(DO-214AA)
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN 1.5SMBJ58CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
1.5SMBJ58CA
Electronic Component
1
Package
SMB(DO-214AA)
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.21g
Electronic Component
1
Channel Count
Electronic Component
Electronic Component
BM0263578206
Voltage
93.6V
Current(Ir)
1uA
Voltage(VBR)
64.4V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

1.5SMBJ58CA 产品概述

一、产品简介

1.5SMBJ58CA 是 BORN(伯恩半导体)出品的一款单路双向瞬态电压抑制(TVS)二极管,封装为 SMB(DO-214AA)。器件采用玻璃钝化芯片与环氧树脂封装工艺,兼顾钳位性能与长期可靠性,专为电信、计算机及工业接口的雷击与浪涌保护设计。

二、主要电气参数

  • 极性:双向(Bidirectional),对两极相反方向瞬态均能限压保护。
  • 反向截止电压 Vrwm:58 V(稳态工作电压)。
  • 击穿电压 VBR:64.4 V(典型)。
  • 钳位电压 Vcl:93.6 V(在指定冲击条件下的钳位电平)。
  • 峰值脉冲电流 Ipp:16.1 A(单次浪涌输入下峰值电流能力)。
  • 峰值脉冲功率 Ppp:1.5 kW(器件可吸收的瞬态能量等级,典型测试条件下)。
  • 反向漏电流 Ir:1 μA(在 Vrwm 条件下的低漏电流特性)。
  • 通道数:单路。

三、主要特点

  • 出色的钳位能力:在浪涌事件中迅速将电压钳制到安全区间,保护后端器件。
  • 低漏电流:在正常工作电压下功耗小,不影响系统静态性能。
  • 低电容:适合高速信号线和接口保护,减少对数据完整性的影响。
  • 高浪涌能力:1.5 kW 能量等级与 16.1 A 峰值电流,能应对常见的雷击和开关瞬态。
  • 玻璃钝化芯片与环氧封装:保证长期稳定性与抗环境能力。

四、典型应用

  • 电信设备:保护基站、交换设备与传输线路免受雷击与浪涌损伤。
  • 计算机与外围设备:电源输入、接口卡、USB/串口等的过压保护。
  • 工业控制:现场总线、传感器节点等抗干扰保护场景。
  • 其它需要双向保护的信号或电源线上。

五、选型建议与注意事项

  • 若系统为直流单向供电,优先考虑单向型 TVS;对交流或可能极性反转的线路,选择本双向器件更合适。
  • 钳位电压应低于被保护器件的最大耐压,但高于正常工作电压 Vrwm 以避免误触发。
  • 注意 Ppp 与 Ipp 标称是基于特定测试波形(厂商标准),实际应用中应结合线路阻抗与波形修正能量需求。
  • 对于高速差分线,关注器件电容值与信号完整性影响,必要时在 PCB 布局上做滤波或隔离处理。

六、封装与焊接指南

  • 封装:SMB(DO-214AA),利于自动贴装与回流焊接。
  • 焊接建议:采用标准回流温度曲线,焊盘应设计为短回流路径以利散热;器件应尽量靠近被保护节点布置,走线短且粗,减少寄生感抗。
  • 热管理:长时间或多次大能量浪涌会升高封装温度,设计时保留足够的散热路径与热沉面积。

七、可靠性与存储

  • 玻璃钝化工艺提高了电气稳定性与潮湿环境下的可靠度。
  • 储存时避免潮湿、极端温度和长时间太阳直射,开封后若为贴片托盘应按推荐湿敏等级(MSL)回流焊接周期使用。

总结:1.5SMBJ58CA 凭借 58 V 工作电压、64.4 V 击穿及 93.6 V 钳位能力,结合 1.5 kW 能量等级与低漏电、低电容特性,是电信与计算机等需双向保护场合的可靠选择。

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