WMSIC Electronic Components

BORN SMFJ60CA

ModelSMFJ60CA
PackageSOD-123F
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ60CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMFJ60CA
Electronic Component
1
Package
SOD-123F
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.045g
Electronic Component
1
Electronic Component
BM0264602964
Voltage
96.8V
Current(Ir)
1uA
Voltage(VBR)
73.7V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ60CA 瞬态抑制二极管(TVS)产品概述

一、产品核心定位与品牌背景

SMFJ60CA是伯恩半导体(BORN) 推出的一款双向瞬态抑制二极管(TVS),核心作用是为低压电路提供快速、可靠的过压防护,抵御静电放电(ESD)、雷击浪涌、开关瞬态等脉冲干扰,避免后端敏感电子元件(如MCU、传感器、接口芯片)因过压损坏。

伯恩半导体作为国内专注功率半导体与防护器件的厂商,其TVS产品以高可靠性、宽温度适应性及成本优势,广泛应用于消费电子、工业控制、通信等领域。SMFJ60CA延续了品牌在防护器件上的技术积累,适配多种小型化、低压电路场景。

二、关键电气性能参数解析

SMFJ60CA的电气参数针对低压电路防护优化,核心参数可分为电压防护层级、脉冲耐受能力及静态特性三类:

1. 电压防护层级

  • 反向截止电压(Vrwm):60V
    器件正常工作时反向可承受的最大连续电压,需匹配电路工作电压上限(如电路工作电压≤55V时可安全使用),避免TVS误触发。
  • 击穿电压(Vbr):73.7V(典型值)
    反向击穿的启动电压,当电路电压超过此值时,TVS快速导通分流,将电压钳位在安全范围。
  • 钳位电压(Vc):96.8V
    脉冲峰值时器件两端的最大电压,需低于后端元件的耐压极限(如芯片耐压≥100V时可有效防护)。

2. 脉冲耐受能力

  • 峰值脉冲电流(Ipp):1.8A
    可承受的最大瞬态脉冲电流,覆盖常见的静电及浪涌冲击。
  • 峰值脉冲功率(Ppp):200W(@10/1000μs波形)
    该波形为国际标准浪涌波形(10μs上升沿、1000μs半峰值时间),适配开关浪涌、雷击次级浪涌等场景。

3. 静态特性

  • 反向漏电流(Ir):1μA(@Vrwm)
    正常工作时反向漏电流极小,几乎不影响电路功耗,保证系统效率。

三、封装设计与物理特性

SMFJ60CA采用SOD-123F表面贴装封装,具备以下实用特点:

  • 尺寸紧凑:典型封装尺寸为2.5mm(长)×1.2mm(宽)×1.0mm(厚),适配智能手机、可穿戴设备等小型化电路;
  • 焊接兼容:符合无铅回流焊工艺要求(RoHS标准),适合自动化生产;
  • 机械可靠:塑料外壳耐振动、耐冲击,可适应工业环境及移动设备的复杂工况。

四、典型应用场景

结合参数特性,SMFJ60CA主要应用于以下领域:

  1. 消费电子接口:智能手机、平板的USB充电口、Type-C数据接口,防护静电及充电浪涌;
  2. 工业控制电路:PLC输入输出端口、4-20mA传感器接口,抵御现场开关浪涌;
  3. 通信设备:路由器、交换机的以太网接口、电源端口,防护雷击浪涌及静电干扰;
  4. 低压电源模块:12V/24V/48V直流电源输出端,防止负载切换产生的瞬态过压。

五、选型与应用注意事项

为确保防护效果,应用时需注意以下要点:

  1. 电压匹配:Vrwm需≥电路正常工作的最大电压(如48V系统选60V Vrwm);
  2. 功率匹配:Ppp需≥电路可能承受的最大浪涌功率(200W覆盖大部分低压场景);
  3. 安装位置:靠近被保护元件或接口,减少线路阻抗对防护效果的影响;
  4. 极性优势:双向设计无需区分正负,安装便捷,适合正负脉冲同时存在的接口(如USB Vbus与GND)。

SMFJ60CA凭借双向防护、紧凑封装及可靠性能,成为低压电路过压防护的高性价比选择,可满足多领域的防护需求。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.