WMSIC Electronic Components

BORN SMBJ9.0A

ModelSMBJ9.0A
PackageSMB
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMBJ9.0A
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMBJ9.0A
Electronic Component
1
Package
SMB
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.32g
Electronic Component
1
Electronic Component
BM0264900529
Voltage
15.4V
Current(Ir)
10uA
Voltage(VBR)
11.1V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMBJ9.0A 产品概述

一、概述

SMBJ9.0A 是 BORN(伯恩半导体)出品的一款单向瞬态抑制二极管(TVS),采用SMB封装,适用于电信和计算机等系统的浪涌与尖峰保护。器件采用玻璃钝化芯片与环氧树脂封装,兼顾耐冲击性与封装可靠性,提供稳定的过压钳位能力与低漏电流特性。

二、主要参数

  • 极性:单向
  • 反向工作电压 Vrwm:9 V
  • 击穿电压 VBR:11.1 V(典型)
  • 钳位电压 Vc:15.4 V(在指定脉冲条件下)
  • 峰值脉冲电流 Ipp:39 A
  • 峰值脉冲功率 Ppp:600 W(10/1000 μs 波形)
  • 反向漏电流 Ir:10 μA(典型)
  • 类型:TVS(瞬态电压抑制二极管)
  • 封装:SMB(表面贴装)

三、关键特性与优势

  • 优秀的钳位能力:在大幅度浪涌时能将电压迅速钳位到安全范围,保护下游器件不受过压损伤。
  • 低漏电流:待机功耗低,适用于要求节能或高阻抗输入的电路。
  • 低电容设计:对高速信号影响小,适合数据线和通信接口的保护(相对于大容值器件影响更小)。
  • 高浪涌能力:600 W(10/1000 μs)和39 A 峰值脉冲电流,能应对电源投切、雷击诱发的脉冲能量。
  • 可靠的制造工艺:玻璃钝化芯片与环氧封装保证长期稳定性与环境适应性。

四、典型应用

  • 电信设备:基站接口、电源线和信号线的浪涌保护。
  • 计算机与外设:电源输入、USB/串口供电保护、电源管理模块。
  • 工业控制与仪器:电源总线及敏感控制信号的过压防护。
  • 其它需要对瞬态过压抑制的场景。

五、使用建议

  • 器件为单向TVS,推荐按标注方向将被保护正极接至器件的阳极/阴极端(详见数据手册),反向工作电压 Vrwm 应大于电路最大工作电压以避免误触发。
  • 钳位电压 15.4 V 为在标准脉冲条件下测得的典型值,实际钳位随浪涌波形、脉冲幅度及环境温度会有所变化,设计时应留有裕量。
  • 在高能量脉冲频繁出现的场合,应考虑器件的热耗散与重复冲击寿命,并在必要时并联或选用更高功率等级器件。
  • 布局上尽量缩短被保护回路到接地的引线长度,优化地回路以降低感抗带来的电压升高。

六、封装与可靠性

SMB 封装适用于自动贴装与回流焊工艺。典型的封装稳定性良好,但建议遵循厂商的回流焊温度曲线和峰值温度限制,避免超出推荐焊接参数。器件采用玻璃钝化,提高对机械应力和湿度的耐受性,适合工业级应用环境。

七、选型注意事项

  • 确认系统最大工作电压 ≤ Vrwm,若接近 Vrwm,应考虑留有安全裕量或选用更高 Vrwm 的型号。
  • 若系统需保护高速差分信号,需关注器件的结电容指标并评估对信号质量的影响。
  • 对于特殊标准(如某些工业雷击等级或航空应用),请参考完整数据手册并与厂方沟通评估。

如需更详细的电气特性曲线、封装尺寸或应用参考电路,可联系供应商获取 SMBJ9.0A 的完整数据手册。

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