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BORN DSS12
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN DSS12
- Type
- BORN
- Minimum package
- 3000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- DSS12
- Electronic Component
- 1
- Package
- SOD-123FL
- Electronic Component
- Schottky Diode
- Electronic Component
- 0.042g
- Electronic Component
- 1
- Electronic Component
- BM0264583403
- Current
- 1A
- Diode
- 1
- (Vf)
- 550mV@1A
- Electronic Component
- 55℃~+125℃
- Electronic Component
- Electronic Component
- Electronic Component
- 3000
- Voltage Rating(Vr)
- 20V
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
DSS12 产品概述
一、产品简介
DSS12 是 BORN（伯恩半导体）推出的一款小型低压整流二极管，采用独立式封装，针对低压快速整流和开关电源回路保护优化设计。器件以模塑塑料封装，结构紧凑，适合高密度表贴电路应用。
二、主要参数
- 正向压降 (Vf)：约 0.55 V @ 1 A
- 直流反向耐压 (Vr)：20 V
- 额定整流电流：1 A（连续）
- 非重复峰值浪涌电流 (Ifsm)：25 A
- 工作结温：-55 ℃ ~ +125 ℃
三、封装与极性
封装形式：SOD-123FL 塑料贴片封装。
极性识别：器件表面色带标示阴极，便于装配和自动化贴片确认。小巧封装利于在空间受限的电路板上布置，多点并联或旁路应用时可节省面积。
四、特性与优势
- 低正向压降，减少导通损耗，适用于低压整流与输出整流环节。
- 峰值浪涌能力良好（25 A），能承受瞬态冲击电流，增强系统鲁棒性。
- 宽温度范围适应工业级环境，可靠性高，适合工业与消费类电子产品。
- SOD-123FL 提供良好机械强度与可焊性，兼容自动化贴装流程。
五、典型应用
- 开关电源（SMPS）输出整流与续流管
- 电池充电器与电源管理模块
- 反向保护与防反接电路
- 低压直流电路的一般整流与滤波
六、使用建议与可靠性注意事项
- 组装时建议采用规范化回流焊工艺并参照器件制造商的焊接曲线与 IPC/J-STD 标准，以避免过热损伤。
- 在高频开关或高温环境下，应考虑封装散热限制并进行适当的热设计和散热路径布置。
- 设计 PCB 时，优化焊盘尺寸与铜箔散热区域以降低结温，提高长期可靠性。
- 存储与搬运遵循常规电子元器件防潮、防静电要求，必要时采用干燥保存并在规定时间内回流焊。
总结：DSS12 以其低 Vf、良好的浪涌承受能力和工业级温度范围，适合各类低压整流与保护场景，是空间受限电路中性价比较高的选型之一。若需更详细的电气特性曲线或回流焊参数，建议参考 BORN 提供的器件数据手册。
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