WMSIC Electronic Components

BORN SMDJ85CA

ModelSMDJ85CA
PackageDO-214AB
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMDJ85CA
Type
BORN
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMDJ85CA
Electronic Component
1
Package
DO-214AB
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.392g
Electronic Component
1
Electronic Component
BM0264602947
Voltage
137V
Current(Ir)
1uA
Voltage(VBR)
94.4V
Electronic Component
Electronic Component
Electronic Component
3000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMDJ85CA 产品概述

一、产品简介

SMDJ85CA 是 BORN(伯恩半导体)推出的一款双向瞬态抑制二极管(TVS),额定反向工作电压 VRWM = 85V,专为抑制大能量浪涌和瞬态过电压设计。器件采用 DO-214AB(SMA)表面贴装封装,能够在工业、电源和通讯设备中提供稳定可靠的浪涌保护。

二、主要性能参数

  • 类型:双向 TVS(Bipolar)
  • 反向截止电压 VRWM:85 V
  • 击穿电压 VBR:94.4 V(典型测试条件)
  • 钳位电压 Vc:137 V(在 10/1000 μs 浪涌下)
  • 峰值脉冲电流 Ipp:21.9 A(对应 10/1000 μs 波形)
  • 峰值脉冲功率 Ppp:3000 W(10/1000 μs)
  • 反向漏电流 Ir:1 μA(在 VRWM 条件下,典型值)
  • 封装:DO-214AB(SMA 封装,适合 SMD 工艺)

三、性能特点

  • 双向结构:对正负极瞬态电压均能有效钳位,适用于交流或双向瞬态场景。
  • 大能量吸收:3000W 的 10/1000 μs 峰值功率能力,可承受较强的雷击或开关瞬态冲击。
  • 低钳位电压:在规定脉冲下钳位电压约 137V,减少下游电路承受的过压应力。
  • 低漏电流:典型反向漏电仅 1 μA,有助于降低待机功耗。
  • 标准 SMD 封装:DO-214AB 便于自动贴装和回流焊接,可靠性高。

四、典型应用场景

  • 电源输入浪涌保护(直流或交流系统)
  • 工业控制与自动化设备的浪涌防护
  • 通信设备、基站和网络设备的端口过压保护
  • 逆变器、变频器等大功率设备的瞬态抑制

五、封装与热管理

DO-214AB(SMA)封装便于 PCB 布局和散热设计,但在高能量脉冲事件中需考虑良好的铜箔散热路径与适当的焊盘面积。建议在器件两端设计充足的铜层并靠近散热层连接,以便脉冲能量通过 PCB 分散,减少器件温升和热应力。

六、选型与注意事项

  • 确认工作电压与最大允许钳位:若工作点接近或高于 VRWM,应考虑更高 VRWM 型号或并联保护。
  • 考虑脉冲能量与频率:3000W(10/1000 μs)为单次或短脉冲能力,若长期多次冲击需评估热应力与可靠性。
  • PCB 布线:尽量缩短连接走线,避免长导线引入高感抗导致额外过压。
  • 温度影响:VBR、Vc 和漏电流会随温度变化,需参照器件温度特性曲线(技术规格书)进行设计裕度计算。

七、储运与封装信息

器件为标准 DO-214AB 表面贴装封装,适用于常规 SMT 贴装和回流焊工艺。储存时避免潮湿与高温,按工业级或符合 IPC 标准的干燥包装处理,必要时进行烘烤除湿后贴片。

总结:SMDJ85CA 以其 85V 的工作电压、双向抑制能力和 3000W 的瞬态吸收能力,适合需要中高压、抗雷击和大能量浪涌保护的工业与电源应用。设计时注意散热、脉冲频次及 PCB 布局,可获得长期稳定的保护效果。

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