WMSIC Electronic Components

BORN SMFJ26CA

ModelSMFJ26CA
PackageSOD-123FL
BrandBORN
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BORN SMFJ26CA
Type
BORN
Minimum package
3000 未知

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BORN
Electronic Component
SMFJ26CA
Electronic Component
1
Package
SOD-123FL
Electronic Component
Electronic Component
Type
TVS
Electronic Component
ESD and Surge Protection (TVS / ESD)
Electronic Component
0.035g
Electronic Component
1
Electronic Component
BM0264692226
Operating Temperature
55℃~+150℃
Voltage
42.1V
Current(Ir)
1uA
Voltage(VBR)
31.9V
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SMFJ26CA 瞬态抑制二极管(TVS)产品概述

一、产品基本属性

SMFJ26CA是一款双向瞬态抑制二极管(TVS),由伯恩半导体(BORN)专业设计生产,采用SOD-123FL小型表面贴装封装。作为电路过压防护的核心器件,TVS可快速响应瞬态浪涌(如静电放电、电源尖峰、雷击感应等),将电压钳位至安全范围,避免后级敏感电路(如IC、传感器、MOS管)被击穿损坏,保障系统稳定运行。

二、核心电气参数解析

SMFJ26CA的参数针对低压过压防护优化,关键指标如下:

  • 反向截止电压(Vrwm):26V
    电路正常工作时,器件可承受的最大反向直流/交流电压,确保静态下不导通,不干扰电路功能。该参数适配12V/24V等主流低压系统。
  • 击穿电压(Vbr):31.9V(典型值)
    当电压超过此值时,器件进入雪崩击穿状态,快速导通泄放浪涌电流,响应时间仅为纳秒级。
  • 钳位电压(Vc):42.1V(@Ipp=4.8A)
    浪涌电流通过时,器件两端被钳位的最高电压,远低于多数后级器件的耐压极限(如常见IC耐压≤5V),实现有效保护。
  • 峰值脉冲电流(Ipp):4.8A(@10/1000μs浪涌波形)
    可承受的单次最大浪涌电流,对应IEC 61000-4-5标准中的典型浪涌强度(如2kV/2Ω浪涌)。
  • 峰值脉冲功率(Ppp):200W(@10/1000μs)
    浪涌期间器件的最大功率耗散,验证了其抗浪涌能力,无需并联多个器件即可满足多数场景需求。
  • 反向漏电流(Ir):1μA(@Vrwm=26V)
    静态下反向漏电流极小,几乎不增加电路功耗,适合低功耗便携设备或电池供电系统。
  • 工作温度范围:-55℃~+150℃
    覆盖极端环境温度,可满足汽车发动机舱、工业高温车间等严苛场景的可靠性要求。

三、典型应用场景

SMFJ26CA的参数特性使其适配多类低压防护场景:

  1. 汽车电子:车载12V/24V系统(如中控显示屏、胎压传感器、ECU接口),应对点火浪涌、静电放电及电磁干扰。
  2. 工业控制:PLC输入输出端口、电机驱动电路、工业传感器节点,抵御现场浪涌冲击(如电机启停尖峰)。
  3. 消费电子:充电器、USB接口、音频/视频端口,保护设备免受插拔浪涌、静电损伤(如手机充电口、耳机接口)。
  4. 通信设备:以太网端口、无线模块接口,符合通信设备的浪涌防护要求(如10/100M以太网)。

四、封装与可靠性优势

  • SOD-123FL封装:小型表面贴装设计(尺寸约2.9×1.6×1.0mm),适合高密度PCB布局,降低产品体积与重量,适配便携设备。
  • 双向极性:无需区分正负引脚,安装便捷且减少极性错误风险,提升生产效率。
  • 宽温可靠性:-55℃~+150℃温度范围通过汽车级AEC-Q101等可靠性测试,可在极端环境下长期稳定工作。
  • 焊接兼容性:适配回流焊、波峰焊等常规SMT工艺,焊接可靠性高,降低生产不良率。

五、品牌与应用价值

伯恩半导体(BORN)作为国内专业半导体厂商,SMFJ26CA具备以下应用价值:

  • 参数精准匹配:26V Vrwm与12V/24V系统电压适配,钳位电压42.1V与后级器件耐压形成合理防护区间,避免过度防护或防护不足。
  • 简化电路设计:200W Ppp及4.8A Ipp满足多数实际浪涌需求,无需并联多个TVS,减少PCB空间占用与成本。
  • 低功耗适配:1μA漏电流确保静态下不影响电路效率,适合电池供电的便携设备(如智能手环、蓝牙耳机)。

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