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BORN SMD2920-500/24N
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN SMD2920-500 / 24N
- Type
- BORN
- Minimum package
- 1500 编带
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BORN
- Electronic Component
- SMD2920-500/24N
- Electronic Component
- 1
- Package
- 2920
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.21g
- Electronic Component
- 1
- Electronic Component
- 5s
- Electronic Component
- BM0229906775
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 24V
- Power(Pd)
- 1.5W
- Current(Imax)
- 40A
- Electronic Component
- Electronic Component
- Electronic Component
- 1500
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SMD2920-500/24N 产品概述
一、产品简介
SMD2920-500/24N 为 BORN（伯恩半导体）推出的贴片型熔断器/保险丝，封装尺寸为 2920（约 2.9 × 2.0 mm），用于对低压直流系统进行过流保护。器件在正常工作电流下保持低阻抗导通，在发生过流并满足动作条件时跳闸以保护后级电路和负载。
二、主要参数
- 额定耐压（Vmax）：24 V DC
- 最大通过电流（Imax）：40 A
- 保持电流（Ihold）：5 A（在此电流下器件长期保持导通）
- 跳闸电流（Itrip）：10 A（达到或超过该电流并维持动作时间则触发跳闸）
- 动作时间：5 s（达到 Itrip 时的典型触发时间）
- 功耗（Pd）：1.5 W（器件在特定条件下的最大耗散功率）
- 初始态阻值（Rmin）：5 mΩ（未跳闸前典型低阻抗）
- 跳断后阻值（R1max）：25 mΩ（跳闸后阻值上限）
- 工作温度范围：-40 ℃ 至 +85 ℃
三、典型功能与特性
- 低电阻导通：初始阻值仅约 5 mΩ，有利于减少导通损耗和热量积累。
- 精确过流门限：保持电流与跳闸电流差值明确，便于在含有浪涌或启动电流的系统中设定裕量。
- 快速保护响应：在超过 10 A 且持续 5 s 的情况下实现跳闸，适合中等持续过流保护。
- 宽工作温度：-40 ℃ 至 +85 ℃，可用于工业、通信及汽车电子等多种环境（请按实际环境热耦合评估）。
四、典型应用场景
- 电源模块、DC-DC 转换器输入侧过流保护。
- 电池管理、便携设备电源保护。
- 工业控制及通信设备的局部短路/过载防护。
- 高电流分配网络中作为支路保护元件。
五、设计与使用注意事项
- 余量设计：建议在正常工作电流下留有安全裕度（Iwork ≤ 0.8 × Ihold）以避免误动作。
- 浪涌与启动电流：若系统含高启动电流，需验证瞬态是否会触发 5 s 门限；必要时采用并联或缓启动电路。
- 散热考虑：器件功耗 Pd=1.5 W 与封装热阻相关，PCB 铜箔、接地平面和贴片布局应优化以降低结温。
- 焊接与可靠性：按封装厂商的回流焊温度曲线执行，避免超温或长时间加热；存储与清洗按标准流程，避免化学残留影响接触性能。
- 测试验证：在目标系统环境（最高环境温度、最大工作电流、最差工况）下进行过流与循环测试，验证跳闸一致性与跳断后阻值变化。
六、选型与采购建议
- 型号完整标识：SMD2920-500/24N，品牌 BORN（伯恩半导体）。
- 批量选型时关注批次一致性与供应商出具的电气特性曲线（I-T 曲线、阻值随温度变化等）。
- 若需更高电流、不同动作时间或更低导通阻抗，请提供目标工况以协助推荐相近规格产品或并联方案。
如需针对具体电路的热仿真、PCB 布局建议或替代器件比较，可提供电路工作电流、最大允许温升及预计环境温度以便进一步评估。
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