Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BORN S9015
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BORN S9015
- Type
- BORN
- Minimum package
- 3000
Technical parameters
- Electronic Component
- BORN
- Electronic Component
- S9015
- Electronic Component
- 1
- Package
- SOT-23
- Electronic Component
- 1 PNP
- Electronic Component
- Transistor(BJT)
- Electronic Component
- 0.031g
- Electronic Component
- 1
- Electronic Component
- BM0263572182
- Operating Temperature
- 55℃~+150℃
- Transistor Type
- PNP
- Frequency(f T)
- 150MHz
- Power Dissipation(Pd)
- 200mW
- Electronic Component
- 3000
- Collector Current(Ic)
- 100mA
- Current (h FE)
- 200
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
S9015 产品概述
一、产品简介
S9015 是由 BORN（伯恩半导体）推出的一款小信号 PNP 三极管，采用 SOT-23 小型封装，单颗供应（数量：1 个）。该器件针对低功耗、高增益的开关和放大场合进行了优化，适合便携设备、信号级放大与高侧开关等应用。
二、主要参数
- 晶体管类型：PNP
- 集电极电流 Ic：100 mA（最大）
- 集射极击穿电压 Vceo：45 V（最大）
- 耗散功率 Pd：200 mW（在规定散热条件下）
- 直流电流增益 hFE：200（典型）
- 特征频率 fT：150 MHz（典型）
- 集电极截止电流 Icbo：100 nA（典型）
- 集射极饱和电压 VCE(sat)：300 mV（典型）
- 射基极击穿电压 Vebo：5 V（最大）
- 工作温度范围：-55 ℃ ~ +150 ℃
- 封装：SOT-23
三、主要特性
- 高直流电流增益（hFE≈200），便于小基流驱动大集电电流，降低驱动功耗。
- 高频特性好（fT≈150 MHz），适合音频与射频前端的信号放大。
- 低饱和压（VCE(sat)≈300 mV），在开关闭合时降低功耗和发热。
- 低漏电（Icbo≈100 nA），有利于高阻抗电路与静态功耗要求高的系统。
- 宽温度范围和耐压特性（Vceo 45 V），可在较恶劣环境下稳定工作。
四、典型应用
- 高侧开关与电源控制（PNP 架构适合正电源侧开关）。
- 小信号放大器、前置放大与驱动级。
- 电平转换、逻辑接口与负载切换。
- 移动设备、消费电子、传感器接口与低功耗模块。
五、使用建议与典型电路要点
- 工作在饱和区时，为确保 VCE(sat) 指标，建议采用“强制 β”（βforced）约 10–20，计算基极电流 Ib ≈ Ic / βforced。
- 基极限流电阻计算：Rb = (Vdrive - Vbe_on) / Ib（PNP 的 Vbe_on 约 0.6–0.8 V，注意极性与驱动电压关系）。
- 功耗 Pd = Vce × Ic，SOT-23 封装散热有限，建议在设计 PCB 走铜与热墩以提升散热能力，避免长期接近 200 mW 极限。
- 禁止基极承受超过 Vebo（5 V），避免损伤基极结。
六、封装与可靠性
SOT-23 小封装便于表面贴装和高密度组装。器件在-55 ℃ 到 +150 ℃ 范围内可正常工作，适合工业级应用。建议在焊接与回流时遵循厂家温度曲线，避免超温造成性能退化。
七、选型建议
若需在 100 mA 级别、45 V 耐压、且要求高增益与小饱和压的 PNP 器件，S9015 是一款兼顾性能与成本的选择。对于需要更高功耗或更大电流的场合，应考虑更大封装或功率更高的器件。同时在实际设计中评估 PCB 散热与基极驱动能力，以确保长期可靠运行。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
