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BOURNS MH2029-601Y
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS MH2029-601Y
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- MH2029-601Y
- Electronic Component
- 1
- Package
- 0805
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.028g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0242478187
- Operating Temperature
- 55℃~+125℃
- Current
- 1A
- @Frequency
- 600Ω@100MHz
- Resistor(DCR)
- 200mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MH2029-601Y 产品概述
一、产品简介
MH2029-601Y 是 BOURNS 出品的一款单通道磁珠（ferrite bead），封装为 0805（约 2.0 mm × 1.25 mm），针对电磁干扰（EMI）抑制与高频噪声滤除设计。其标称阻抗为 600 Ω @ 100 MHz，适用于高频噪声控制的紧凑电路板布局场景。
二、主要规格
- 阻抗：600 Ω @ 100 MHz，误差 ±25%
- 直流电阻（DCR）：200 mΩ（typical）
- 额定电流：1 A
- 通道数：1
- 工作温度：-55 ℃ ~ +125 ℃
- 品牌/型号：BOURNS / MH2029-601Y
- 封装：0805（表面贴装）
三、电气特性与其工程含义
该磁珠在 100 MHz 处提供较高阻抗，可有效衰减高频干扰。DCR 为 200 mΩ，意味着在直流通过时会有电压降（1 A 时约 0.2 V）及功率耗散（P = I^2·R ≈ 0.2 W）。因此在电源线应用时须评估电压降和发热影响，必要时考虑并联或选用更低 DCR 的器件。
阻抗公差 ±25% 提示实际滤效会随个体差异和布局而变化，设计时应留有裕量并通过实测确认 EMI 抑制效果。
四、封装与安装注意事项
0805 的紧凑体积适合空间受限设计。推荐做法：
- 将磁珠尽量靠近噪声源或噪声进入点放置（例如电源进入点、芯片电源脚上方）。
- 与旁路电容配合形成低通滤波（磁珠串联，负载侧并联电容）。
- 注意焊盘尺寸与焊接工艺，避免因焊接不良造成电阻增加或机械应力。
- 在高电流或高温应用中，检查器件温升并参考厂商热特性说明。
五、典型应用场景
- DC 电源线高频抑制与去耦
- 电源入口或模块隔离的 EMI 滤波
- 通信和高速数字板上的共模/差模干扰抑制（单通道串联）
- 模拟信号线的高频噪声抑制（需评估对信号完整性的影响）
六、选型与使用建议
- 若电路中电流接近 1 A，应评估功耗与温升，必要时选择额定电流更高或 DCR 更低的型号。
- 对关键频段（如 100 MHz 附近）有严格抑制要求时，建议查阅完整阻抗-频率曲线并做板级测量。
- 并联使用或多级滤波（磁珠 + 电容）可以提升低频和宽频带的抑制性能。
- 对于汽车或工业级应用，确认温度循环和机械冲击下的可靠性数据（制造商资料）。
七、结论
MH2029-601Y 在 0805 小型封装中提供了在 100 MHz 处 600 Ω 级别的阻抗，适合对高频噪声有抑制需求且要求小体积的设计。使用时需兼顾 DCR 带来的电压降与功耗，合理布板与配合旁路元件可取得良好 EMI 抑制效果。对于最终设计，建议结合厂商完整数据表进行热/频率特性验证与板级测试。
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