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BOURNS MH1608-221Y
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS MH1608-221Y
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- MH1608-221Y
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.036g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0256952460
- Operating Temperature
- 55℃~+125℃
- Current
- 2A
- @Frequency
- 220Ω@100MHz
- Resistor(DCR)
- 100mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MH1608-221Y 产品概述
一、产品简介
MH1608-221Y 为 BOURNS 系列 0603（1608 公制）外形的磁珠抑制元件，标称在 100MHz 处阻抗 220Ω，公差 ±25%。器件为单通道设计，适用于对高频干扰和电磁噪声进行衰减与抑制，是移动设备、电源滤波和高速信号线去耦的常用元件。
二、主要性能参数
- 阻抗：220Ω @ 100MHz（±25%）
- 直流电阻（DCR）：约 100 mΩ
- 额定电流：2A（连续额定，请参考应用条件）
- 通道数：1（单端）
- 工作温度：-55℃ ~ +125℃
- 封装：0603（约 1.6 mm × 0.8 mm）
这些参数决定了该磁珠在高频段具有良好抑制能力，同时直流电阻较低，对电源轨的压降与功耗影响可控。
三、应用建议与选型要点
- 用途：去耦高频干扰、抑制电源/信号线的射频噪声、改善 EMI 性能。
- 选型关注点：若工作频段集中在百兆赫兹附近，220Ω 的阻抗能有效衰减；对更低频段噪声需求，则需配合电容或使用更大阻抗的器件。
- 电流与压降：在 2A 时理论电压降约 0.2V（I×DCR），理论功耗 I^2·DCR ≈ 0.4W；实际应用应考虑温升与厂商的热性能说明，必要时并联多只或选更大封装。
四、封装与可靠性
0603 小型封装适合高密度 PCB 布局，机械强度与焊接可靠性良好。工作温度覆盖工业级范围（-55℃ 至 125℃），在正常回流焊工艺下可用于表面贴装制造，但建议参考 BOURNS 官方数据手册以确认焊接曲线与可靠性试验数据。
五、布局与电路注意事项
- 靠近噪声源或干扰产生处放置，最短引线接入需抑制辐射。
- 与旁路电容配合使用，磁珠做串联，电容接地形成低通滤波效果。
- 对于低电压大电流轨，注意压降影响并评估热量积累；必要时采用更低 DCR 或更大封装产品。
六、替代与扩展
当电流需求超过 2A 或需更低压降时，可考虑更大封装或并联多只磁珠；若需共模抑制，应选择共模电感/共模磁珠。选型时优先参考厂商完整数据手册以获得阻抗曲线、频率响应与温升特性。
总结：MH1608-221Y 以其在 100MHz 附近显著的阻抗、低直流电阻与小尺寸封装，适合对高频 EMI 抑制有明确需求且对电流与压降有可控余量的便携和工业类应用。
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