WMSIC Electronic Components

BOURNS TBU-CA065-100-WH

ModelTBU-CA065-100-WH
PackageSMD,6.5x4mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS TBU-CA065-100-WH
Type
BOURNS
Unit
Electronic Component
Minimum package
3000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
TBU-CA065-100-WH
Electronic Component
1
Electronic Component
4mm
Package
SMD,6.5x4mm
Electronic Component
Surge Protector
Electronic Component
0.112g
Electronic Component
6.5mm
Electronic Component
0.9mm
Electronic Component
1
Channel Count
1
Features
positions
Electronic Component
BM0228269598
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TBU-CA065-100-WH 产品概述

一、产品简介

TBU-CA065-100-WH 是 BOURNS 面向线路级瞬态保护的单通道表面贴装型瞬态阻断单元(TBU,Transient Blocking Unit)。该器件在正常工作时呈低电阻通路,当线路出现超过设定触发电流的瞬态过流或冲击事件时,器件迅速进入高阻态以阻断能量传递,从而保护下游敏感电路。器件小巧(6.5 × 4.0 × 0.9 mm),适合对 PCB 面积和高度有限制的应用场合。

二、主要参数与物理特性

  • 型号:TBU-CA065-100-WH(BOURNS)
  • 封装:SMD,外形尺寸 6.5 mm × 4.0 mm × 0.9 mm
  • 通道数:1(单通道)
  • 工作电压:300 V
  • 触发电流:100 mA ~ 200 mA(触发范围,可用于设计灵敏度匹配)
  • 导通电阻 RDS(on):13.2 Ω(正常工作低阻态)
  • 复位电压 Vreset:20 V(当线路电压降至此值以下可复位回低阻态)
  • 工作温度范围:-55 ℃ ~ +125 ℃
  • 描述备注:SURGE SUPP TBU 100MA 650VIMP(描述中标注 650 V IMP 表示器件具有相应的冲击/脉冲承受能力或用于表征抗冲击性能的参数,设计时应参考厂商完整规格书以确认性能边界)

三、工作原理与保护行为

TBU 的典型工作机制为:在正常电流下,器件维持低阻态(示例中 RDS(on) ≈ 13.2 Ω),允许信号或电源通过;当线路电流超过预设触发电流(本器件 100–200 mA 范围)时,TBU 快速转换到高阻态,限制传输到下游的能量,从而保护后端电路。高阻态可持续阻断高能量脉冲,直到线路电压降至复位电压(Vreset ≈ 20 V)以下,器件才会自动复位回低阻态,实现非破坏性的可恢复保护。

该动作方式不同于单纯钳位型器件(如 TVS),更适合在长期或高能量脉冲下保护下游电路,避免被动器件在能量吸收时过热或损坏。

四、典型应用场景

  • 通信线路保护:DSL、以太网、串口及其它敏感数据链路
  • 电源输入保护:PoE、工业电源输入、分布式电源接口(在 300 V 级别内)
  • 工业与楼宇自动化:现场传感器、变送器、远程 I/O 模块
  • 消费与便携设备:在尺寸受限但需高可靠保护的终端产品中应用
  • 测试与测量设备:保护精密前端不受瞬态冲击影响

五、设计注意事项与推荐做法

  • 串联安装:TBU 应串联在被保护线路上,尽量靠近外部入线处或可能受干扰的接口处放置,以最快速度阻断入侵能量。
  • 与其他保护器件配合:对于高能量或易出现高压冲击的系统,可将 TBU 与 TVS、气体放电管、慢熔断器(PTC/熔断器)或共模电感组合使用,以实现多级保护(快速断流 + 钳位 + 能量分散)。
  • 热管理:虽然 TBU 能在高能量事件中工作,但在 PCB 布局时应为器件提供适当的散热路径及铜箔面积,避免重复脉冲导致过度升温。
  • PCB 布局:最短的串联走线、良好的接地和旁路设计可提升保护效果并减少寄生影响。
  • 回流焊工艺:参考 BOURNS 的焊接与回流曲线建议,避免因过热或参数不当影响可靠性。

六、优势与对比

  • 小尺寸与低高度(6.5 × 4.0 × 0.9 mm),适用于空间受限的设计。
  • 清晰的触发电流范围(100–200 mA),便于与电路工作电流匹配,提供精准保护。
  • 可恢复性设计,非一次性牺牲性保护器件,降低维护成本。
  • 宽温区间(-55 ℃ 至 +125 ℃),满足工业级可靠性需求。
    在需要既能快速响应又能承受多次冲击的应用中,TBU 比单纯的 TVS 更适合作为第一道保护层,尤其是在需要阻断能量而非仅钳位电压的场合。

七、订购信息与后续建议

  • 型号/品牌:TBU-CA065-100-WH(BOURNS)
  • 封装与尺寸:SMD,6.5×4 mm
  • 在最终设计前,请参考 BOURNS 官方数据手册,核实冲击承受能力(文中描述的 650 V IMP)、极限参数以及回流焊工艺和可靠性测试建议。若系统有特殊电压或能量等级需求,可联系厂商获取更详尽的应用支持与测评数据。

如需我帮您根据具体电路(工作电流、最大容许电压、外部保护器件配置)进行选型匹配或布板建议,可以提供电路简图与使用环境,我会给出更具体的设计建议。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.