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BOURNS MH1608-800Y
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS MH1608-800Y
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 4000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- MH1608-800Y
- Electronic Component
- 1
- Package
- 0603
- Electronic Component
- Ferrite Bead
- Electronic Component
- ±25%
- Electronic Component
- 0.029g
- Electronic Component
- 1
- Channel Count
- 1
- Electronic Component
- BM0227778313
- Operating Temperature
- 55℃~+125℃
- Current
- 3A
- @Frequency
- 80Ω@100MHz
- Resistor(DCR)
- 40mΩ
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
MH1608-800Y 产品概述
一、产品简介
MH1608-800Y 为 BOURNS 出品的一款表面贴装磁珠（磁环），封装尺寸为 0603（即 1608 公制）。该器件主要用于电磁干扰（EMI）抑制与高频噪声滤除，适配空间受限的现代电子设备PCB设计，兼顾高频抑制性能与低直流损耗。
二、主要参数
- 阻抗：80 Ω @ 100 MHz（阻抗值用于表征高频噪声抑制能力）
- 直流电阻（DCR）：40 mΩ（低 DCR 可降低功率损耗与压降）
- 额定电流：3 A（在该电流下器件可正常工作，超过应参照热管理与降额设计）
- 阻抗公差：±25%（阻抗有一定波动范围，设计时需考虑容差）
- 工作温度：-55 ℃ ~ +125 ℃（宽温区适用于工业级环境）
- 通道数：1（单通道磁珠）
- 品牌 / 封装：BOURNS / 0603
三、性能特点
- 高频抑制能力强：在 100 MHz 附近表现出 80 Ω 的显著阻抗，能够有效衰减高频干扰分量。
- 低直流阻抗：40 mΩ 的 DCR 在保证噪声抑制的同时，最大限度降低功耗与热量产生，适合较大电流场合。
- 宽温特性与可靠性：-55~+125 ℃ 的工作温度范围适配工业级应用，对环境适应能力强。
- 小尺寸、高密度：0603 封装适合高密度 PCB 布局，有利于体积受限产品的 EMI 方案实现。
四、典型应用
- 电源线上高频噪声滤除与去耦（DC-DC 输入输出、LDO 前后端）
- 数字通信与射频前端的 EMI 抑制（高速总线、接口电源）
- 汽车电子、工业控制、消费电子等需兼顾电源完整性与电磁兼容的场景
五、使用建议与注意事项
- 器件须按常规 SMD 回流焊工艺安装，建议参考 BOURNS 的焊接与拆装指南以避免过热损伤。
- 设计时应考虑阻抗公差（±25%）对滤波性能的影响，必要时可并联或串联多个磁珠以调整效果。
- 对于接近额定电流工作点的方案，应关注 PCB 散热与温升，必要时采取降额使用以延长寿命。
- 建议将磁珠布置靠近噪声源或接口处，避免在敏感信号线上引入不必要的寄生影响。
以上信息基于器件关键参数给出，具体电性能曲线、封装尺寸图和可靠性试验数据请参阅 BOURNS 官方规格书与器件数据手册。
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