WMSIC Electronic Components

BOURNS TC33X-2-501E

ModelTC33X-2-501E
PackageSMD-3P,3.8x3.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS TC33X-2-501E
Type
BOURNS
Unit
Electronic Component
Minimum package
2500 圆盘

Technical parameters

Power
100mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
TC33X-2-501E
Electronic Component
1
Package
SMD-3P,3.8x3.6mm
Electronic Component
Resistor / positions
Electronic Component
±25%
Electronic Component
0.055g
Electronic Component
500Ω
Electronic Component
1
Electronic Component
BM0257677130
Electronic Component
±250ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

TC33X-2-501E 可调电阻/电位器 产品概述

概要

TC33X-2-501E 是由BOURNS公司生产的高性能可调电阻/电位器,适用于各种电子设备中的精确调节应用。以下是对此产品的详细介绍。

基础参数

  • 电阻值: 500 Ohms
  • 功率: 0.1W (100mW)
  • 容差: ±25%
  • 温度系数: ±250ppm/°C
  • 匝数: 1
  • 调节类型: 顶部调节
  • 电阻材料: 金属陶瓷
  • 安装类型: 表面贴装型 (SMD)
  • 端接样式: J 引线
  • 大小/尺寸: 矩形 - 0.150" x 0.142" 表面 x 0.047" 高(3.80mm x 3.60mm x 1.20mm)

描述

TC33X-2-501E 是一种小尺寸、低功耗的可调电阻/电位器,专为需要高精度和稳定性的应用而设计。其采用金属陶瓷材料,确保了良好的电气性能和耐用性。

应用场景

  1. 音频设备:

    • 在音频设备中,TC33X-2-501E 可用于调节音量、平衡或音调等参数。
    • 由于其低噪声和高稳定性,非常适合高保真音频系统。
  2. 自动控制系统:

    • 在自动控制系统中,TC33X-2-501E 可用于调节控制信号的幅度或偏置。
    • 其高精度和低温度漂移使其成为工业自动化中的理想选择。
  3. 医疗设备:

    • 医疗设备需要高可靠性和精确控制,TC33X-2-501E 的稳定性和耐用性使其成为医疗设备中的优选元件。
    • 可用于调节监测信号、治疗参数等。
  4. 消费电子产品:

    • 在消费电子产品如电视、音响、游戏机等中,TC33X-2-501E 可用于用户界面上的调节功能。
    • 其小尺寸设计使其易于集成到紧凑的 PCB 布局中。

特点

  • 高精度:

    • ±25% 的容差和 ±250ppm/°C 的温度系数,确保了在各种环境条件下保持稳定的电阻值。
  • 低功耗:

    • 仅需 100mW 的功耗,使其适用于低能耗设计,延长设备使用寿命。
  • 小尺寸设计:

    • 仅 3.80mm x 3.60mm x 1.20mm 的尺寸,使其易于集成到现代电子设备的紧凑 PCB 布局中。
  • 金属陶瓷材料:

    • 采用金属陶瓷材料,提供了优异的电气性能和机械强度,提高了整体可靠性。
  • 表面贴装型 (SMD):

    • 支持自动化生产流程,提高生产效率和降低成本。
  • 顶部调节:

    • 方便用户进行精确调节,适用于需要频繁调整参数的应用场景。

安装和使用注意事项

  • 安装:

    • 请按照标准 SMD 焊接过程进行安装,以确保良好的接触和可靠性。
    • 确保 PCB 设计符合推荐的焊接区域和间距要求。
  • 使用:

    • 在使用前,请检查电位器是否有任何物理损伤或污染。
    • 避免过度旋转或施加过大的机械力,以防损坏内部结构。

总结

TC33X-2-501E 由BOURNS公司生产,是一种高性能、低功耗的小尺寸可调电阻/电位器。其优异的电气性能、稳定性和耐用性,使其广泛应用于音频设备、自动控制系统、医疗设备以及消费电子产品等领域。通过选择 TC33X-2-501E,您可以确保您的电子设备具有高精度和可靠性的调节功能。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.