Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS SF-0603S200-2
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS SF-0603S200-2
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 5000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- SF-0603S200-2
- Electronic Component
- 1
- Electronic Component
- 0.8mm
- Package
- 0603
- Type
- SMD Fuse
- Electronic Component
- Non-Resettable Fuse
- Electronic Component
- 0.024g
- Electronic Component
- 1.6mm
- Electronic Component
- 0.45mm
- I2t
- 0.115
- Electronic Component
- 1
- Electronic Component
- 50A
- Electronic Component
- BM0265215403
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SF-0603S200-2 产品概述 — BOURNS 0603 贴片式保险丝
一、产品简介
SF-0603S200-2 为 BOURNS 推出的板面贴装（board-mount）一次性微型保险丝，封装为 0603（1608 公制），尺寸为 1.6 mm × 0.8 mm。额定电流 2A、额定电压 32VDC，适用于对空间与高度有严格限制的板级过流保护场合。
二、主要参数
- 型号：SF-0603S200-2（BOURNS）
- 封装：0603（1608 公制）
- 外形尺寸：长度 1.6 mm，宽度 0.8 mm
- 额定电流：2 A
- 额定电压：32 V DC
- 工作温度：-20 ℃ ～ +105 ℃
- 熔断能量（I2t）：0.115（A^2·s，典型值）
- 分断能力：50 A（最大分断能力）
三、产品特性与优势
- 超小尺寸：0603 贴片封装，适配自动贴装与回流焊，节省 PCB 面积并降低器件高度。
- 高分断能力：50 A 的分断能力在短路或瞬态大电流情况下可有效中断故障电流，保护下游器件。
- 明确的能量限制（I2t）：I2t = 0.115 A^2·s，可用于设计过流保护与选择熔断响应的能量预算。
- 宽工作温度范围：适合大多数工业与消费电子环境。
- 适用于板级保护：可直接贴装在 PCB 上，实现可靠的局部电源保护。
四、典型应用场景
- 手机、平板、可穿戴设备等便携终端的电源轨保护
- USB、Type-C 接口与充电电路的过流保护
- 电池管理与电源模块的短路保护
- 汽车电子、车载充电器（注意温度与车规要求需额外确认）
- 工业与通信设备中对板级功率回路的保护
五、设计与装配建议
- 尺寸与焊盘：采用厂家推荐的 PCB 焊盘尺寸与过孔布局，以保证良好焊接与热特性。
- 回流焊工艺：兼容主流无铅回流流程；具体温度曲线请参照 BOURNS 数据表与焊接工艺规范，避免过度热应力影响可靠性。
- 温度降额：在高环境温度下，应考虑对额定电流进行适当降额，确保长期可靠性。
- 选型匹配：若需延时熔断或更高/更低额定电流，请根据电路的短路能量（I2t）与分断需求选择相应型号。
六、可靠性与选型提示
在设计前应参考原厂完整数据手册，确认熔断时间曲线、阻抗-温度特性及封装机械规范。对于关键或高可靠性应用，建议做实际电路级的过流测试与温升验证，以确定在目标工作工况下的行为符合系统安全要求。
如需采购或获取原厂数据手册（Datasheet）、推荐 PCB 焊盘与回流曲线，请联系 BOURNS 正式渠道或授权分销商，获取最新的技术资料与可追溯的质量信息。
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