Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS SA77SB0
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BOURNS SA77SB0
- Type
- BOURNS
- Minimum package
- 5000 个
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- SA77SB0
- Electronic Component
- 1
- Package
- SMD-4P,5.4x3.2mm
- Type
- Electronic Component
- Electronic Component
- Thermal Switch
- Electronic Component
- 0.474g
- Electronic Component
- 1
- Channel Count
- 1
- Features
- Electronic Component
- Electronic Component
- 77℃
- Electronic Component
- BM0257053263
- Electronic Component
- ±5℃
- Electronic Component
- Electronic Component
- Electronic Component
- 5000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SA77SB0 产品概述
一、产品简介
SA77SB0 为 BOURNS 品牌的一款机械式温控开关，类型为单通道（1 通道）单刀单掷常闭触点（SPST-NC）。该器件在环境或被测体温度上升到 77℃ 时动作，动作温度精度为 ±5℃。封装形式为 SMD-4P，外形尺寸约 5.4 × 3.2 mm，适合表面贴装工艺的紧凑型热保护应用。
二、主要特点
- 机械式动断，动作可靠、响应迅速；常闭设计在正常温度下导通，超温时断开保护负载。
- 额定为单通道单刀单掷，结构简单，便于与电路直接串联实现过温保护。
- 小型 SMD-4P 封装（5.4×3.2 mm），节省 PCB 空间，适合体积受限的终端设备。
- 动作温度 77℃，精度 ±5℃，适用于中等温度阈值的保护场景。
三、典型技术参数（基于提供信息）
- 类型：机械式温控开关
- 通道数：1（单通道）
- 接点形式：SPST-NC（常闭）
- 动作温度：77℃
- 动作温度精度：±5℃
- 封装：SMD-4P，封装尺寸约 5.4 × 3.2 mm
- 品牌：BOURNS
注：具体的电气额定电流、电阻值、绝缘电阻、耐压及寿命循环次数请以官方数据手册为准，设计时需参考完整规格书。
四、典型应用场景
- 电池管理与充电保护（防过热断开）
- 电源模块与充电器的温度保护
- LED 驱动与照明装置过温保护
- 小型电机、风扇控制器及家电产品的局部过热防护
- 工业与消费类电子设备的局部热监控与安全断电应用
五、封装与焊接建议
- 采用常规 SMT 回流工艺贴装。由于为机械式微动结构件，焊接热应控制在器件许可范围内，建议参考 BOURNS 官方回流曲线或与供应商确认是否支持无铅回流温度峰值。
- 在 PCB 布局时为器件预留适当的热通道或隔热区域，根据热源位置设计热传导路径，以确保动作温度可被准确触发。
- 贴装后避免在器件上施加过大机械应力（挤压、弯曲），以免影响内部触点动作精度与寿命。
六、可靠性与使用注意
- 机械式温控器存在一定的温度滞后与触点磨损，实际动作点与制造标称值可能受安装方式、热耦合和长期老化影响，建议在样机阶段进行实测确认。
- 对于关键安全场合，应采用冗余或级联保护策略，或者配合电子温度监控实现二次保护。
- 购买与设计前请索取 BOURNS 官方数据手册（包含电气额定、耐久性循环、存储与使用温度范围、回流焊规范等），以完成最终设计验证与可靠性评估。
如需我帮您整理该型号的完整规格表、PCB 封装库或回流焊接建议曲线，可提供进一步帮助。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
