WMSIC Electronic Components

BOURNS MF-SM100/33-2

ModelMF-SM100/33-2
PackageSMD,7.3x5.4mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS MF-SM100/33-2
Type
BOURNS
Minimum package
2000

Technical parameters

Electronic Component
BOURNS
Electronic Component
MF-SM100/33-2
Electronic Component
1
Electronic Component
5.4mm
Package
SMD,7.3x5.4mm
Electronic Component
Resettable Fuse
Electronic Component
0.58g
Electronic Component
7.3mm
Electronic Component
3mm
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0209680532
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
33V
Power(Pd)
1.7W
Current(Imax)
40A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

MF-SM100/33-2(BOURNS)产品概述

一、产品简介

MF-SM100/33-2 为 BOURNS 出品的表面贴装可复位自恢复保险(PTC Resettable Fuse),设计用于在过流或短路情况下提供可重复的过流保护。器件典型封装尺寸约 7.3 × 5.4 × 3 mm,适配 SMD 焊盘安装,提供带卷盘(T/R)供应,便于自动贴片生产线使用。

二、主要电气与机械参数

  • 保持电流(Ihold):1.1 A(典型)
  • 动作电流(Itrip):2.2 A(典型)
  • 最大工作电压(Vmax):33 V
  • 峰值容许电流(Imax):40 A
  • 初始态电阻(Rmin):0.12 Ω
  • 跳断后最大电阻(R1max):0.41 Ω
  • 功耗能力(Pd):1.7 W
  • 典型动作时间:约 0.5 s(在规定过流条件下)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 尺寸(典型):长 7.3 mm × 宽 5.4 mm × 高约 3 mm
  • 封装形式:SMD,适配标准焊盘

三、产品特性与优势

  • 可复位:过流解除后器件温度恢复,阻值返回到低阻态,恢复电路通断,无需更换元件。
  • 小封装、高密度:7.3×5.4 mm 紧凑体积,适用于空间受限的消费电子和工业设备。
  • 高瞬态承受能力:最高可承受 40 A 峰值电流,能应对白色家电、电源输入以及电机驱动等瞬态冲击。
  • 宽温范围工作:-40~+85 ℃ 适应大多数商业与工业环境。
  • 规范化供应:SMD + T/R 卷盘包装,满足自动化贴装与量产需求。

四、典型应用场景

  • 移动与便携设备电源线、充电保护
  • 工业控制模块输入保护、传感器供电防短路
  • 电机驱动与继电器线圈保护(用于抑制反复短路或卡住情况)
  • 汽车电子辅助回路(需结合环境温度与车规要求评估)
  • 各类消费电子、通信设备和电源适配器的过流保护

五、选型与应用注意事项

  • 工作点裕量:设计中应使正常工作电流低于 Ihold,避免长期靠近 Ihold 导致频繁动作或温升。
  • 温度影响:环境温度升高会降低动作电流阈值,设计时应考虑最坏工况(高温+负载)下的动作情况。
  • 焊盘与散热:尽量按厂商推荐焊盘布局设计,保证良好焊接与热传导,避免局部过热影响重复动作性能。
  • 初次上电冲击:若电路存在较大浪涌(如电感反向或充电电容),需评估器件能否承受冲击电流或在前端加限制元件(如限流电阻)。
  • 可靠性测试:在实际应用中,建议做温度循环与反复动作寿命验证,确认在目标环境下性能稳定。

六、结论

MF-SM100/33-2 是一款适合中等电流保护需求的 SMD 可复位保险,兼顾体积与承载能力,适用于多种消费与工业场景。合理的电气裕量、良好的散热与正确的焊接工艺,可确保长期稳定的过流保护性能。如需更具体的焊盘建议、热特性曲线或寿命数据,建议参考 BOURNS 官方数据手册或联系供应商获取完整规格说明书。

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