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BOURNS MF-SM150/33-2
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BOURNS MF-SM150/33-2
- Type
- BOURNS
- Minimum package
- 1500
Technical parameters
- Electronic Component
- BOURNS
- Electronic Component
- MF-SM150/33-2
- Electronic Component
- 1
- Electronic Component
- 6.7mm
- Package
- SMD-2
- Electronic Component
- Resettable Fuse
- Electronic Component
- 0.857g
- Electronic Component
- 8.8mm
- Electronic Component
- 3mm
- Electronic Component
- 1
- Electronic Component
- 5s
- Electronic Component
- BM0264528764
- Operating Temperature
- 40℃~+85℃
- Voltage Rating(Vmax)
- 33V
- Power(Pd)
- 1.9W
- Current(Imax)
- 40A
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BOURNS MF-SM150/33-2 产品概述
一、产品简介
BOURNS MF-SM150/33-2 为聚合物正温度系数（PTC）自恢复保险元件，专为 PCB 表面贴装（SMT）保护设计。额定保持电流 Ihold 1.5A，最大耐受电流 Imax 可达 40A，最大工作电压 Vmax 33V，器件在正常工作态初始电阻约 Rmin = 60 mΩ，跳断后最高电阻 R1max = 230 mΩ，工作温度范围 -40℃ 至 +85℃。封装为 SMD-2，外形尺寸约 8.8 × 6.7 mm（厂商标识 MF-SM 系列，型号 MF-SM150/33-2）。
二、主要特点
- 自恢复保护：过流或短路时迅速升阻限流，故障消除后自动恢复，便于重复使用和维护。
- 低初始电阻：60 mΩ 的低阻值有利于降低正常工作时的功率损耗与热量产生。
- 高抗冲击电流能力：40A 的瞬态承受能力适合抑制电源浪涌与启动电流。
- 宽温度范围：-40℃ 至 +85℃，适用于工业级与消费类环境。
- SMT 贴片封装：适配自动化贴装与回流焊工艺，提高生产效率与可靠性。
三、典型应用
- USB、以太网与通信接口过流保护。
- 电池组、充电模块与便携设备电源防护。
- 开关电源、LED 驱动与电机驱动的输入短路保护。
- 工业控制与汽车电子的局部电路保护（在符合工作温度与认证前提下）。
四、设计与布局建议
- 建议将 MF-SM150/33-2 放置于靠近电源入口或被保护负载的 PCB 线上，以最短回路实现快速响应。
- 使用厂商推荐的焊盘尺寸与间距，确保焊点可靠性与热传导均匀。
- 回流焊时遵循无铅回流工艺规范并参照制造商的温度曲线，避免过高峰值温度或过快升降温速率。
- 在高散热场合可在其附近留出铜箔以辅助热量扩散，但需注意不要影响元件跳断特性。
五、选型注意事项
- 按实际工作电流选择保持电流需留有安全裕度，考虑环境温度与连续工作时间会降低器件允许通过电流。
- 对于频繁冲击或长时间高温工况，应验证跳断时间–电流曲线与恢复特性是否满足系统需求。
- 考虑到跳断后阻值可达 230 mΩ，设计中需评估跳断状态下对系统电压与热平衡的影响。
六、储存与可靠性
- 按一般 SMD 元件管理，避免潮湿、强紫外及化学腐蚀，必要时在回流前进行烘干处理。
- 推荐在设计验证阶段进行过流、温升与寿命试验，确认在目标应用场景下的长期可靠性与重复自恢复性能。
总结：MF-SM150/33-2 是一款面向 PCB SMT 的高冲击能力、低初始阻值的 PTC 自恢复保险器，适合用于各类中低压直流供电系统的过流保护。在选型与布局时应遵循厂家工艺推荐并留足电流与温度裕度，以保证系统稳定与长期可靠。
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