Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3313J-1-202E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS 3313J-1-202E
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 1000 圆盘
Technical parameters
- Power
- 125mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 1
- Electronic Component
- 3313J-1-202E
- Electronic Component
- 1
- Package
- SMD,3.5x3.2mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±20%
- Electronic Component
- 0.153g
- Electronic Component
- 2kΩ
- Electronic Component
- 1
- Electronic Component
- BM0000285011
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
产品概述：BOURNS 3313J-1-202E 可调电阻器
一、概述
BOURNS 3313J-1-202E 是一款高质量的可调电阻器，具有 2 kΩ 的电阻值，适用于各种电子电路的应用。它采用表面贴装 (SMD/SMT) 封装，体积紧凑，适合空间受限的设计。其额定功率为 0.125W（1/8W），确保在多种工作条件下的稳定性能。
二、基础参数
- 电阻值：2 kΩ
- 功率额定值：0.125W (1/8W)
- 容差：±20%
- 温度系数：±100 ppm/°C
- 匝数：1
- 调节类型：顶部调节
- 电阻材料：金属陶瓷
- 安装类型：表面贴装型
- 端接样式：J 引线
- 尺寸：矩形 - 0.138" x 0.126"（3.50mm x 3.20mm）, 高 0.087"（2.20mm)
三、设计特点
BOURNS 3313J-1-202E 在设计上采用了金属陶瓷材料，这使得电阻元件具有更好的热稳定性和可靠性。其 ±100 ppm/°C 的温度系数表明在温度变化时，电阻值的变化极小，从而为用户提供了较为稳定的应用表现。这种高精度的电阻器适合在要求严格的电路设计中使用。
四、调节方式
这款可调电阻器支持顶部调节，方便设计工程师在电路调试时进行精确的电阻值调整。这种便捷的调节方式能够加速产品的开发过程，尤其是在多变的应用环境中，允许设计师根据需求快速响应。
五、产品应用
BOURNS 3313J-1-202E 可广泛应用于各类电子设备中，如：
- 消费电子产品（如音响、电视、手机等）
- 工业控制系统
- 通信设备
- 医疗设备
- 汽车电子系统
由于其优异的性能，该元器件可用于调整信号增益、作为调音器、以及在传感器和反馈环路中进行电平设置。
六、安装及兼容性
作为一款表面贴装电阻器，BOURNS 3313J-1-202E 可以轻松地在自动化生产线中进行安装，极大地提高了生产效率。此外，其尺寸 (3.50mm x 3.20mm x 2.20mm) 使得其适合与现代多层印刷电路板（PCB）兼容。
七、总结
BOURNS 3313J-1-202E 是一款高性能的可调电阻器，凭借其稳定性、紧凑的设计及易于调节的特点，使其成为各种电子设计中不可或缺的组成部分。无论是在消费电子还是在工业控制领域，BOURNS 的这一产品都能有效满足不同应用场合下的性能需求，确保良好的产品体验。通过使用 BOURNS 3313J-1-202E，设计工程师能够为最终产品提供高质量的信号处理能力和可靠性，为他们的项目增添竞争优势。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
