WMSIC Electronic Components

BOURNS SRP6060FA-100M

ModelSRP6060FA-100M
PackageSMD,6.6x6.4mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRP6060FA-100M
Type
BOURNS
Minimum package
750 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRP6060FA-100M
Electronic Component
1
Package
SMD,6.6x6.4mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.38g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0127472353
Electronic Component
AEC-Q200
Current
5A
Resistor(DCR)
26.6mΩ
Electronic Component
Electronic Component
Electronic Component
750

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRP6060FA-100M 产品概述

一、产品简介

SRP6060FA-100M 是 BOURNS 推出的表面贴装功率电感,额定电感值 10 μH(公差 ±20%),专为电源滤波和能量储存场合设计。器件尺寸紧凑,封装为 SMD,外形尺寸 6.6 × 6.4 mm,兼顾高电流承载能力与良好热性能,适合汽车电子及工业级电源应用。

二、主要电气参数

  • 电感值:10 μH,精度 ±20%
  • 饱和电流(Isat):7.6 A(在规定磁通减少门限下的饱和电流)
  • 额定电流:5 A(长期工作时推荐的最大直流电流)
  • 直流电阻(DCR):26.6 mΩ
  • 车规等级:符合 AEC‑Q200 可靠性要求
  • 封装:SMD,尺寸 6.6 × 6.4 mm
  • 品牌:BOURNS,型号:SRP6060FA‑100M

三、产品特点

  • 高饱和电流:Isat 7.6A,支持大电流瞬态,适用于电流冲击较大的开关电源场合。
  • 良好导通性能:低 DCR(26.6 mΩ)有助于降低 I^2R 损耗,提高转换效率与发热控制。
  • 汽车级可靠性:符合 AEC‑Q200,适配汽车电子(车载稳压、车载充电)及高可靠性工业系统。
  • 紧凑封装:6.6 × 6.4 mm SMD 封装,便于高密度 PCB 布局与自动化贴装。

四、典型应用

  • 降压/升压 DC‑DC 转换器中的储能与滤波电感
  • 汽车电子电源(车载 ECU、电池管理、车载充电)
  • 工业电源模块与点对点电源滤波
  • LED 驱动、电机驱动与其他需要中等电感值与高电流承载的系统

五、选型与使用注意事项

  • 额定电流 vs 饱和电流:额定电流 5 A 为持续工作建议值;Isat 7.6 A 表示在更高电流下电感开始显著下降,应根据系统峰值电流与允许的电感下降选择裕量。
  • DCR 与效率:26.6 mΩ 的直流电阻会带来一定的损耗,设计时需评估热耗散与效率影响,必要时考虑并联或更低 DCR 的型号。
  • 温升与散热:在高电流工作条件下注意器件及周围 PCB 温升,采用短回路路径、热沉或过孔散热可以改善温度性能。
  • 布局建议:尽量缩短高频回路环路面积,输入与输出旁路电容靠近器件引脚布置,以减小 EMI 与寄生阻抗影响。
  • 环境与可靠性:符合 AEC‑Q200,适用于汽车工作温度范围与振动条件,但请依据具体应用参考厂商完整数据手册中的温度及寿命曲线。

六、封装与订购信息

  • 型号:SRP6060FA-100M
  • 品牌:BOURNS
  • 封装规格:SMD,尺寸 6.6 × 6.4 mm
    如需更多电气特性曲线(如频率响应、饱和曲线、温度特性)或样片/采购信息,请参考 BOURNS 官方数据手册或联系供应商获取完整资料。

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