WMSIC Electronic Components

BOURNS CM453232-100KL

ModelCM453232-100KL
Package1812
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS CM453232-100KL
Type
BOURNS
Minimum package
500 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
CM453232-100KL
Electronic Component
1
Package
1812
Type
Inductor
Electronic Component
Power Inductor
Electronic Component
±10%
Electronic Component
0.185g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0258641817
Current
250mA
Resistor(DCR)
1.6Ω
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

CM453232-100KL 产品概述

一、主要参数

CM453232-100KL(BOURNS)是一款表面贴装绕线电感,封装规格为1812(4532公制)。主要电气参数如下:

  • 标称电感:10 µH
  • 电感偏差:±10%
  • 额定直流电流:250 mA
  • 直流电阻(DCR):最大 1.6 Ω
  • 结构形式:无屏蔽、绕线型(表面贴装)

二、功能与特性

该器件以绕线方式获得10 µH电感量,适用于中低频电源滤波与去耦场合。无屏蔽结构在尺寸受限时能提供较大的感量,但会产生一定的外磁场耦合,需在布局上予以考虑。较高的DCR(1.6 Ω)表明在通过额定电流时会有明显的压降与发热,需要在系统设计时评估功耗影响。

三、典型应用场景

  • 低功耗或小电流的DC供电滤波(如传感器模块、便携设备的局部电源滤波)
  • 通信与控制板上的干扰抑制与谐波滤波
  • 作为LC滤波器的一部分,用于开关电源输入或输出滤波(适用于额定电流不超过250 mA的场合)

四、电气与热设计注意事项

  • 功耗估算:在额定电流0.25 A下,功耗约为 P = I^2·DCR = 0.25^2 × 1.6 ≈ 0.10 W,电压降约为 V = I·DCR = 0.25 × 1.6 = 0.4 V。若长期工作在额定电流附近,应关注温升与周围元件的耐热性。
  • 余量与降额:建议在设计中保留一定余量(例如工作电流不超过额定值的 60–80%),以降低磁饱和与发热风险。
  • 外磁场与布局:由于无屏蔽,电感外泄磁场较强,易耦合至附近敏感线路(如模拟前端、高速信号线),建议将其与敏感模块保持距离,并采用合适的走线屏蔽或地平面分割。
  • 其他参数:自振频率(SRF)、频率响应与饱和电流等关键特性请参照制造商完整数据手册以进行精确仿真与验证。

五、封装与焊接建议

  • 封装:1812(4532)SMD,适合常规回流贴片工艺。
  • 焊接:遵循生产商推荐的回流曲线与焊膏规范,避免过高温度或过长时间的热暴露以防磁芯或绕线绝缘材料性能退化。
  • 贴装与清洗:普通贴装注意避免机械应力;清洗时请确认所用溶剂与本件材料相容,以免损伤绝缘层。

六、选型与替代建议

选择该型号时应综合考虑电流承载、DCR导致的压降与发热、以及对外磁场的容忍度。若系统对DCR或压降敏感,可考虑低DCR或带屏蔽的替代品;若需要更高电流能力或更小体积,可参考同类封装或其他工艺(如多层磁性元件)。最终选型与可靠性验证,建议以BOURNS官方数据表和实际样片测试为准。

如需更详细的频率特性、温漂、材料说明或样品测试建议,可提供具体应用电路与工作频段,我将协助进行更针对性的评估与建议。

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