Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS SRP7028A-2R2M
Configuration
1 options
Configuration
Date code within 2 years
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BOURNS SRP7028A-2R2M
- Type
- BOURNS
- Minimum package
- 1000 圆盘
Technical parameters
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- SRP7028A-2R2M
- Electronic Component
- 1
- Package
- SMD,7.3x6.6mm
- Electronic Component
- Power Inductor
- Electronic Component
- ±20%
- Electronic Component
- 0.851g
- Inductor
- 2.2uH
- Electronic Component
- 1
- Electronic Component
- BM0256952457
- Electronic Component
- AEC-Q200
- Current
- 8A
- Resistor(DCR)
- 18mΩ
- Electronic Component
- Electronic Component
- Electronic Component
- 1000
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SRP7028A-2R2M 产品概述
一、产品简介
SRP7028A-2R2M 为 BOURNS 出品的一款车规级功率电感，标称电感值 2.2 μH（公差 ±20%），额定连续电流 8 A，饱和电流（Isat）可达 14 A，直流电阻（DCR）典型值约 18 mΩ。器件为表面贴装封装，外形尺寸 7.3 × 6.6 mm，符合 AEC‑Q200 汽车可靠性标准，适合对可靠性与功率密度有较高要求的应用场景。
二、主要特性与优势
- 高电流承载能力：8 A 连续额定，14 A 峰值饱和，适合高电流开关稳压器与电源模块。
- 低损耗设计：18 mΩ 低 DCR 降低铜耗与热量产生，有利于提高转换效率并减小温升。
- 紧凑封装：7.3×6.6 mm SMD 形式，便于高密度布板与自动化贴装。
- 车规级可靠性：通过 AEC‑Q200 认证，满足汽车环境下的温度循环、振动与湿度要求。
- 稳定性：材料与结构对直流偏置和温度有良好抗性，适用于苛刻工况。
三、典型应用
- 汽车电子：车载 ECU、车灯驱动、ADAS 电源模块、动力电池管理辅助电源。
- 电源转换：同步降压（buck）转换器、POL 模块、点对点电源。
- 工业与消费类：马达驱动、LED 驱动、电池充放电管理、高效 DC‑DC 转换器。
四、设计与布局建议
- 留足余量：在选型时考虑直流偏置和温升，对稳定性要求高的场合建议将工作电流低于额定 8 A。Isat 可用于评估短时冲击电流容限。
- 布局与散热：将电感置于开关节点附近，输入输出走宽铜箔并做过孔过渡以降低寄生阻抗和改善散热；避免与热源或敏感信号线并排走线。
- 焊接与工艺：遵循厂家推荐回流温度曲线，避免长时间高温浸泡；贴装后建议进行 X‑ray 或目检确认焊点质量。
- 测试注意：在带直流偏置的条件下测量电感值，以评估实际工作点的电感下降情况。
五、可靠性与包装
SRP7028A-2R2M 满足 AEC‑Q200 要求，适用于汽车与工业级温度范围与振动环境。常见为卷盘（tape‑and‑reel）包装，便于 SMT 贴片线高速贴装与批量生产。
六、选型要点
- 关注工作温度与电流裕量：根据系统最大直流与纹波电流选型，保证在最高温度下仍有足够电感与未进入饱和区。
- DCR 与效率权衡：若系统对效率极为敏感，可优先选择 DCR 更低的器件，但需注意尺寸与饱和特性是否满足要求。
- 瞬态能力：若存在较大冲击电流或短路情形，确认 Isat 是否能承受短时峰值。
结论：SRP7028A-2R2M 以其高电流能力、低 DCR、车规级可靠性及紧凑 SMD 封装，是汽车与工业级电源设计中用来提高能效与功率密度的理想功率电感选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
