WMSIC Electronic Components

BOURNS SRP7028A-4R7M

ModelSRP7028A-4R7M
PackageSMD,6.6x7.3mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRP7028A-4R7M
Type
BOURNS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRP7028A-4R7M
Electronic Component
1
Package
SMD,6.6x7.3mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
1.011g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0265677891
Electronic Component
AEC-Q200
Current
5.5A
Resistor(DCR)
37mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRP7028A-4R7M 产品概述

一、产品简介

SRP7028A-4R7M 是 BOURNS 推出的功率型片式电感,标称电感值 4.7µH,公差 ±20%,封装为 SMD,外形尺寸 6.6×7.3 mm。该器件为车规等级设计,符合 AEC-Q200 要求,适合对电流能力和可靠性有较高要求的电源应用场景。

二、主要规格

  • 电感值:4.7 µH ±20%
  • 额定电流(Irms):5.5 A
  • 饱和电流(Isat):10 A(典型)
  • 直流电阻(DCR):37 mΩ(典型)
  • 封装:SMD,尺寸 6.6 × 7.3 mm
  • 适用等级:AEC-Q200(车规)

三、关键性能优势

  • 高饱和电流:Isat 达 10A,可在高纹波电流场合维持电感值稳定,适用于大电流降压转换器(buck)和输入滤波场合。
  • 低 DCR:37 mΩ 的低直流电阻有利于减小铜损与发热,提高电源效率并降低温升。
  • 紧凑封装与高功率密度:6.6×7.3 mm 的 SMD 方案便于表面贴装,适配自动化生产,节省 PCB 空间。
  • 车规可靠性:符合 AEC-Q200,经过温度循环、机械应力等可靠性验证,适合汽车和工业级长期运行。

四、典型应用

  • 汽车电子 DC-DC 降压转换器(主/从电源)
  • 工业与通信设备的开关稳压电源
  • LED 驱动及高功率负载的滤波元件
  • 电池管理与电机驱动前端滤波

五、使用与选型建议

  • 电流裕量:选型时建议将器件的额定电流(5.5A)作为连续工作电流参考,并考虑纹波与短时浪涌,必要时以 Isat(10A)评估最大瞬态能力。
  • 散热与布局:尽量将电感放置于热源可散出的区域,采用较短的输入/输出走线以减小寄生阻抗;多层 PCB 可利用铜层散热。
  • 频率与磁通:高频应用中注意芯损与温升,复杂应用请参考 BOURNS 数据手册中的频率响应与温度特性曲线。
  • 焊接工艺:适配通用回流温度曲线,避免在波峰焊或超温峰值下超出厂商推荐值。

六、可靠性与质量保证

SRP7028A-4R7M 作为车规级器件,具备较强的环境适应性和寿命可靠性。符合 AEC-Q200 标准意味着其在高低温循环、机械振动、跌落和湿热等试验项下通过验证,适合长期、苛刻工况使用。量产采购请向供应商索取最新的认证与可靠性测试报告。

七、封装与采购信息

封装形式为 SMD,外形尺寸 6.6×7.3 mm,便于贴片生产线加工。订购与替代件信息、最小包装单位、温度范围及完整电气参数应以 BOURNS 官方数据手册为准,选型阶段建议获取样片进行电路验证。

如需进一步的频率特性曲线、热阻数据或参考设计(例如与常见同步降压芯片配合的典型电路布局),可提供数据手册索引或协助检索厂方技术资料。

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