WMSIC Electronic Components

BOURNS SDR0805-101KL

ModelSDR0805-101KL
PackageSMD,7.8x7.8mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS SDR0805-101KL
Type
BOURNS
Unit
Electronic Component
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SDR0805-101KL
Electronic Component
1
Package
SMD,7.8x7.8mm
Electronic Component
Power Inductor
Electronic Component
±10%
Electronic Component
1.239g
Inductor
100uH
Electronic Component
1
Electronic Component
BM0265677873
Current
720mA
Resistor(DCR)
450mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BOURNS SDR0805-101KL 功率电感产品概述

一、产品定位与核心应用场景

SDR0805-101KL是BOURNS推出的表面贴装(SMD)功率电感,属于低中功率电感系列,核心定位为满足轻量化、高集成度电子设备的能量存储、电源滤波及EMI抑制需求。产品广泛适配消费电子、物联网(IoT)、工业控制等领域,尤其适合对尺寸、功耗敏感的便携式设备或小型电源模块设计。

二、关键参数详细解析

2.1 电感值与精度

标称电感值为100μH(标识“101”,即10×10¹μH),精度范围±10%,无需额外电路补偿即可稳定支撑常规DC-DC转换、滤波电路的电感量偏差要求。

2.2 电流特性

  • 额定电流(Irms):720mA
    指25℃环境下,电感连续工作时自身温升不超过40℃的最大允许电流,是电路长期稳定运行的核心参考指标。
  • 饱和电流(Isat):1.1A
    指电感值下降至标称值70%时的临界电流,反映电感在瞬态大电流场景(如启动、负载突变)下的抗饱和能力,可避免电路输出异常。

2.3 直流电阻(DCR)

直流电阻为450mΩ(0.45Ω),直接影响电感功耗(P=I²×DCR)。低DCR设计可减少能量损耗,提升电源转换效率,尤其适合便携式设备的功耗控制。

三、封装与物理特性

产品采用SMD封装,尺寸约7.8mm×7.8mm(BOURNS官方规格为8.0mm×8.0mm×4.0mm),兼容主流SMT生产线自动化贴装。封装材料具备:

  • 耐热性:满足回流焊温度曲线(峰值245℃±5℃,时间≤10秒);
  • 耐湿性:符合RoHS环保标准;
  • 宽温范围:-40℃至+125℃,适应不同应用场景的环境波动。

四、性能优势解析

  1. 高饱和电流适配瞬态场景:1.1A饱和电流远高于额定电流,可应对电路启动、负载突变等大电流工况,避免电感饱和导致的性能波动;
  2. 低DCR提升转换效率:450mΩ直流电阻有效降低功耗损耗,减少电源模块发热,延长设备使用寿命;
  3. 紧凑封装节省空间:7.8×7.8mm尺寸可优化PCB布局,满足智能手机、智能手表等便携式设备的小型化需求;
  4. BOURNS品牌可靠性:严格的质量控制体系确保产品一致性,降低批量生产不良率。

五、典型应用示例

  • 消费电子:智能手机/平板的DC-DC降压模块、LED背光驱动;
  • 物联网设备:智能传感器、智能家居终端的PMU(电源管理单元)、无线充电滤波;
  • 工业控制:小型PLC辅助电源、电机驱动电路EMI滤波;
  • 车载辅助电路:车载信息娱乐系统低功率电源模块(需结合汽车级认证场景)。

六、选型与使用注意事项

  1. 电流容量匹配:长期工作电流≤720mA,瞬态电流≤1.1A,避免过热或饱和;
  2. 功耗计算:通过P=I²×DCR估算电感功耗,确保PCB局部不超温;
  3. 焊接工艺:遵循BOURNS推荐的回流焊曲线,避免高温损坏电感;
  4. 布局优化:靠近电源输出端布局,远离高频干扰源(如晶振、射频电路),减少电磁耦合。

该产品凭借平衡的参数设计与可靠性能,成为低中功率电源电路的高性价比选择。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.