WMSIC Electronic Components

BOURNS 3313J-1-201E

Model3313J-1-201E
PackageSMD,3.5x3.2mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS 3313J-1-201E
Type
BOURNS
Minimum package
1000 圆盘

Technical parameters

Power
125mW
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
3313J-1-201E
Electronic Component
1
Package
SMD,3.5x3.2mm
Electronic Component
Resistor / positions
Electronic Component
±20%
Electronic Component
0.153g
Electronic Component
200Ω
Electronic Component
1
Electronic Component
BM0257202326
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3313J-1-201E 产品概述

一 概述

3313J-1-201E 是 BOURNS 出品的一款表面贴装可调电阻(单圈电位器),体积小巧、用于电路微调与校准。其标称阻值为 200Ω,额定功率 125mW,公差 ±20%,温度系数 ±100ppm/℃,圈数为 1。封装为 SMD,外形尺寸约 3.5×3.2mm,适合空间受限的电子产品和精密模拟电路中的微调应用。

二 主要参数

  • 品牌/型号:BOURNS / 3313J-1-201E
  • 阻值:200 Ω
  • 精度(公差):±20%
  • 额定功率:125 mW
  • 温度系数(TCR):±100 ppm/℃
  • 圈数:1(单圈,可调范围线性)
  • 封装:SMD,尺寸约 3.5 × 3.2 mm

三 主要特性与优势

  • 小型化设计:3.5×3.2mm 的 SMD 封装,便于在密集 PCB 布局中使用。
  • 低温漂:±100 ppm/℃ 的温度系数保证了在温度变化下的阻值稳定性,换算后在常见工作温度范围内引起的相对变化量较小(例如 60℃ 变化约 0.6%)。
  • 适用于微调:单圈设计适合需快速、粗略或中等分辨率调节的场合,用于偏置、增益微调或参考电平调整。
  • 可靠性:BOURNS 品牌元器件在机械与电气性能上有良好工艺控制,适合量产使用。

四 应用场景

  • 模拟电路中增益、偏置和零点微调。
  • 传感器和测量类设备的校准。
  • 移动设备、便携电子与消费类电子的空间受限调节部位。
  • 电源管理中的精密参考调整(低功率场合)。
  • 原型开发与生产测试中的可调阻值需求。

五 使用建议与注意事项

  • 功率与热管理:额定功率为 125mW,使用时应注意器件不能长期承受接近额定功率的负载,必要时采用功率余量或外部散热措施。
  • 环境与温度:尽管 TCR 较低,但在大温度摆幅环境下仍建议做温度漂移校准,尤其当整体系统要求高精度时。
  • 焊接与工艺:该型号为 SMD 封装,通常兼容回流焊工艺;为确保可靠性,请遵循厂家推荐的回流曲线及清洗工艺(具体参数以厂方数据表为准)。
  • 调节方式:单圈手动或自动调整时注意不要过力以免损伤调节机构。

六 封装与采购信息

  • 封装形式:SMD,尺寸约 3.5×3.2mm。
  • 订购时请确认完整型号与包装方式(卷带、切带或切盘)、最小订购量及合格证书。若用于量产或关键应用,建议随货索取最新数据表与可靠性报告以供验证。

七 推荐的使用场景与电路建议

  • 将其作为分压器使用时注意功耗分配和端子连接可靠性。
  • 在高精度应用中,可通过软件或外部校准电路补偿其初始公差(±20%)和温漂。
  • 对于需要多次调节或频繁操作的场合,评估机械寿命与回差性能,必要时选择更高寿命等级的产品。

总结:3313J-1-201E 以其紧凑的 SMD 封装、适中的功率等级和较低的温漂特性,适合低功耗、空间受限且需进行电路微调的应用场景。购买与设计前,建议参考 BOURNS 的详细数据手册以获取焊接、环境及可靠性等完整技术信息。

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