WMSIC Electronic Components

BOURNS SRR1260-100M

ModelSRR1260-100M
PackageSMD,12.5x12.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRR1260-100M
Type
BOURNS
Minimum package
600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRR1260-100M
Electronic Component
1
Package
SMD,12.5x12.5mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
3.7g
Inductor
10uH
Electronic Component
1
Electronic Component
BM0265677888
Current
5.5A
Resistor(DCR)
20mΩ
Electronic Component
Electronic Component
Electronic Component
600
and Current(Isat)
5.5A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BOURNS SRR1260-100M 屏蔽绕线电感器产品概述

一、产品核心身份与定位

SRR1260-100M是美国BOURNS(伯恩斯)推出的10μH屏蔽绕线功率电感,属于品牌中功率电感系列的定制化型号(标注“非标准”)。产品聚焦电磁干扰控制与中功率电流承载的平衡需求,适配工业控制、通信设备、消费电子等多领域电源电路设计,兼顾效率与可靠性。

二、关键电气性能参数

核心参数明确支撑电路设计验证,具体如下:

  • 电感值:10μH ±20%(工业级常规精度,满足开关电源、DC-DC转换器等拓扑的电感量需求);
  • 额定电流(Irms):5.5A(连续工作状态下的最大允许电流,无热失控风险,性能稳定);
  • 饱和电流(Isat):5.5A(电感值下降至初始值80%时的临界电流,本型号额定电流与饱和电流一致,设计冗余性较好);
  • 直流电阻(DCR):最大20mΩ(高导电率铜线绕制,低电阻降低铜损,提升电源转换效率)。

三、物理封装与结构特点

3.1 封装规格

采用SMD表面贴装封装,外形尺寸为12.5×12.5mm,适配常规SMT产线贴装工艺,无需特殊治具即可焊接,兼容多数PCB板布局。

3.2 结构优势

  • 屏蔽绕线设计:磁芯采用闭合磁路,漏磁量比非屏蔽电感降低约75%以上,减少对周边敏感电路的干扰,简化系统EMC设计;
  • 高导电绕线:使用纯度较高的铜线绕制,确保低DCR的同时,提升电流承载稳定性;
  • 牢固磁芯固定:磁芯与绕线通过专用工艺固定,抗振动、抗冲击性能符合工业级标准,适配严苛环境。

四、典型应用场景

SRR1260-100M的参数特性使其适配以下核心场景:

  1. 开关电源(AC-DC/DC-DC):笔记本电脑、显示器、车载充电器等设备的电源模块,满足中功率输出需求;
  2. 通信设备:路由器、交换机、5G基站的辅助电源电路,低EMI特性适配通信设备电磁兼容要求;
  3. 工业控制:PLC、伺服驱动器、工业传感器的电源单元,宽温适应性覆盖工业高低温场景;
  4. 消费电子:机顶盒、智能电视、智能家居设备的电源模块,平衡效率与成本的设计符合消费电子需求。

五、性能优势解析

  1. 低EMI表现:屏蔽磁路从根源减少漏磁,无需额外EMI滤波器即可满足多数产品电磁兼容标准,降低系统BOM成本;
  2. 高效能转化:20mΩ低DCR在5.5A额定电流下铜损仅0.605W,热耗低,适合高密度电源设计(可减少散热片体积);
  3. 电流稳定性:额定电流与饱和电流一致,避免“超额定但未饱和”的设计困惑,简化电路参数计算;
  4. 宽温适应性:支持-40℃~+125℃工作温度范围(BOURNS电感常规规格),覆盖车载、工业等场景;
  5. 可靠性保障:成熟绕线与磁芯固定工艺,经过振动、温度循环测试,MTBF符合行业标准。

六、选型与应用注意事项

  1. 温度降额:高温环境(+85℃以上)建议将工作电流降额至4.5A左右,避免磁芯性能下降;
  2. 焊接工艺:回流焊峰值温度不超260℃(铁氧体磁芯耐受上限),焊接时间不超10秒,防止磁芯损坏;
  3. 非标准属性:因型号标注“非标准”,需确认与客户电路定制化需求匹配,避免直接替换标准电感;
  4. 散热设计:密集PCB布局中,建议电感周边预留散热空间,或通过PCB铜箔辅助散热。

该产品以平衡的电气性能、可靠的结构设计,成为中功率电源电路的实用选型,适合对EMI、效率有明确要求的工程设计。

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