Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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Technical data
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
SRP7050TA-220M 为 BOURNS 推出的片式功率电感,标称电感值 22 µH,公差 ±20%,额定直流电流 2.5 A,饱和电流(Isat)5.5 A。器件为 SMD 封装,外形尺寸约 7.3 × 6.6 mm,符合车规级 AEC-Q200 可靠性要求,适用于对可靠性和温度稳定性有较高要求的电源前端与开关转换场合。
实例电气计算:在额定电流 2.5 A 下,DC 功率损耗 P = I^2·DCR ≈ 2.5^2·0.14 ≈ 0.875 W,电压降约 U = I·DCR = 0.35 V;存储能量 E = 0.5·L·I^2 ≈ 69 µJ(2.5 A 时)。
DCR 引起的 I^2R 损耗在 2.5 A 条件下接近 0.9 W,会导致明显温升,必须在实际设计中考虑散热路径与版面热阻。建议根据实际工作温度对额定电流进行降额(例如高温或封装密集时减少工作电流),并通过铺铜、大量过孔或靠近地铜区域来改善散热。
SMD 封装尺寸 7.3×6.6 mm,适合自动贴装与回流焊流程。焊盘设计应遵循厂商推荐的 PCB footprint,用以保证机械强度与散热。回流焊温度曲线请参考 BOURNS 的焊接说明。
产品符合 AEC-Q200,表明经过温度循环、机械冲击、湿热、盐雾等车规测试,适合汽车电子系统。尽管如此,在高湿、高盐或极端温度环境下仍需在系统级进行老化与环境试验验证。
结论:SRP7050TA-220M 以其 22 µH、电流能力和车规认证,适合汽车与工业级开关电源与滤波应用。实际采用时需关注 DCR 导致的功耗与温升,并按厂商数据手册优化 PCB 布局与散热设计。若需更详细的频率响应、温升测试曲线或封装示意图,请参阅 BOURNS 官方数据手册或联系厂商工程支持。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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