WMSIC Electronic Components

BOURNS SRN6045-1R8Y

ModelSRN6045-1R8Y
PackageSMD,6x6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRN6045-1R8Y
Type
BOURNS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRN6045-1R8Y
Electronic Component
1
Package
SMD,6x6mm
Electronic Component
Power Inductor
Electronic Component
±30%
Electronic Component
0.71g
Inductor
1.8uH
Electronic Component
1
Electronic Component
BM0264532939
Current
3.7A
Resistor(DCR)
19.8mΩ
Electronic Component
Electronic Component
Electronic Component
1000
and Current(Isat)
7A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRN6045-1R8Y 产品概述

一、产品简介

SRN6045-1R8Y 是 BOURNS 推出的表面贴装功率电感,尺寸为 6×6mm,针对中高电流点负载与开关电源滤波场景优化设计。其标称电感量为 1.8 µH(公差 ±30%),适用于要求体积小、能承受较大直流偏流的电源应用。

二、主要参数

  • 电感值:1.8 µH(±30%)
  • 额定电流:3.7 A(长期允许通过以满足温升与电感保持要求)
  • 饱和电流 Isat:7 A(磁芯进入明显磁饱和、感值大幅下降时的参考)
  • 直流电阻 DCR:19.8 mΩ(低 DCR 有利于降低铜损)
  • 封装:SMD,尺寸 6×6 mm
  • 品牌:BOURNS

三、产品特性

  • 高电流能力:额定 3.7A,短时可承受接近 7A 的饱和电流,适合点负载和降压转换器。
  • 低 DCR:约 19.8 mΩ,减少导通损耗,提高效率。
  • 紧凑封装:6×6mm SMD 形式便于自动贴装,节省 PCB 面积。
  • 可重复性与可靠性:由知名品牌生产,适合量产与长期供应(详细可靠性参数请参阅厂家资料)。

四、典型应用

  • 同步降压(buck)或升降压(buck-boost)直流-直流转换器
  • 电源管理模块(PMIC)与点负载供电
  • 网络设备、工业与消费类电子中对中高电流滤波和储能的场合

五、封装与焊接建议

  • 建议根据 BOURNS 的回流焊曲线进行贴装,避免超温或长期过热导致磁芯性能退化。
  • 在 PCB 设计中为电感两端提供充分的铜箔和短回路路径,必要时添加过孔以改善散热。

六、选型与注意事项

  • 注意电感随直流偏流和温度的下降(DC bias 性能)以及 ±30% 的初始公差对实际电路谐振与滤波的影响,必要时在目标工作电流下验证实际电感值。
  • 以额定电流 3.7A 为长期使用基准,避免长期接近或超过 Isat 以免引起电感下降和效率恶化。
  • 若需符合特殊认证(如汽车级 AEC-Q100),请确认厂方具体型号和证书。

七、可靠性与热设计建议

  • 在高功率应用中关注封装温升与周围元件热耦合,合理安排散热路径与器件间距。
  • 出货前建议参阅 BOURNS 的完整数据手册与可靠性报告,按应用场景做温升与电感保持测试。

如需完整数据表、回流曲线或在特定电路(例如某型号降压芯片组合)中的仿真/选型建议,我可协助提供进一步分析与参考方案。

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