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Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
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BOURNS 3314J-1-501E是一款高精度的表面贴装型可调电阻(电位器),其电阻值为500Ω,具有0.25W(1/4W)的功率处理能力。这款电位器的容差为±20%,同时其温度系数为±100ppm/°C,确保了其在不同温度环境下的稳定性。这些特性使其在多种应用领域中广受欢迎,特别是在需要高可靠性和精确调节的电子设备中。
BOURNS 3314J-1-501E采用方形SMD封装,尺寸为0.177" x 0.177" x 0.100"(约4.50mm x 4.50mm x 2.55mm),这一紧凑的设计使得该元器件适合于空间受限的电路板。这种小尺寸减小了整体电路板的占用面积,同时也便于制造与自动化焊接,符合现代电子设备对布局和成本的严格要求。
该电位器采用金属陶瓷作为电阻材料,相较于传统的碳基电阻,金属陶瓷电阻具有更好的温度稳定性和更低的噪声水平。金属陶瓷电阻的结构使其在高功率应用中表现出色,具有更低的功耗和较长的使用寿命。这种材质的应用确保了BOURNS 3314J-1-501E在工作过程中具备高精度和低漂移的特性。
高精度调节:其电阻值为500Ω,并支持±20%的容差,使得在设计电路时,可以通过顶部调节精确地控制电阻值,从而实现细微的调节。这在音频设备、传感器和信号处理应用中尤为重要。
温度稳定性:温度系数为±100ppm/°C的特性极大降低了因温度变化而导致的电阻值偏差,使得在宽温度范围内,设备可以保持良好的性能,尤其适合自动化设备和环境变化较大的应用。
适应性强:该元器件的构造和设计使其适用于多种安装平台,特别是在现代电子设备日益小型化的今天,无论是在消费电子、工业设备还是通信设备中,均能大显身手。
BOURNS 3314J-1-501E广泛应用于各种领域,包括但不限于:
BOURNS 3314J-1-501E是一款高性能的可调电阻,凭借其出色的电气性能和小巧的SMD封装,适用于各类现代电子设计。无论是对尺寸有严格限制的紧凑型设备,还是对性能要求极高的应用场景,BOURNS 3314J-1-501E都能够提供卓越的解决方案。使用该元器件可以帮助设计师实现高精度、高可靠性的电子设计,满足现代技术不断提升的需求。
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Product sourcing intelligence
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
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