WMSIC Electronic Components

BOURNS 3314G-1-501E

Model3314G-1-501E
PackageSMD-3P,4.5x4.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration Date code within 2 years

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS 3314G-1-501E
Type
BOURNS
Unit
Electronic Component
Minimum package
500 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
3314G-1-501E
Electronic Component
1
Package
SMD-3P,4.5x4.5mm
Electronic Component
Resistor / positions
Electronic Component
±20%
Electronic Component
0.304g
Electronic Component
500Ω
Electronic Component
1
Electronic Component
BM0229253482
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3314G-1-501E 产品概述

3314G-1-501E 是 BOURNS 的一款小尺寸可调电阻(微调电位器/Trim Pot),以紧凑的 SMD 封装和经济的电气性能为特色,适用于需要板上调节、校准与偏置微调的电子产品。该型号提供 500Ω 标称阻值、单圈调节结构与 4.5 × 4.5 mm 的 SMD-3P 封装,适合高密度 PCB 布局与自动贴装生产线。

一、主要参数一览

  • 标称阻值:500 Ω
  • 精度(初始阻值公差):±20%
  • 功率额定:250 mW
  • 温度系数:±100 ppm/°C
  • 圈数:1(单圈)
  • 封装:SMD-3P,尺寸 4.5 × 4.5 mm
  • 品牌:BOURNS (以上参数为典型规格,详细的电气/机械特性请参照原厂数据手册)

二、产品特性与优势

  • 紧凑封装:4.5 × 4.5 mm 的 SMD-3P 封装体积小,利于在空间受限或高密度布局的电路板上使用。
  • 单圈调节:单圈结构简单、响应迅速,适合需要快速调节的场合,如一次性校准或现场微调。
  • 稳定性良好:±100 ppm/°C 的温度系数在同类微调器件中属于较为稳定的水平,有助于在温度变化环境中维持阻值精度。
  • 标准化兼容 SMT 生产:SMD-3P 引脚布局便于自动贴片与回流焊,适配常见的生产流程与装配工艺。
  • 经济型精度:±20% 的阻值公差使其在成本敏感型应用中依旧能提供必要的调节功能,适合粗调或设定范围较宽的场景。

三、典型应用场景

  • 电路零点/增益校准:用于放大器、AD/DA 前端的零点与增益微调。
  • 传感器偏置调整:在传感器接口或桥路中调节偏置电压/电流以获得最佳输出。
  • 电源与稳压电路:用于设定参考点或微调输出电压(注意功率限制)。
  • 消费电子与便携设备:适配空间受限的 PCB 布局,进行出厂校准或维修调整。
  • 工业仪表与测试设备:作为现场或工厂校准的调节元件。

四、使用与设计注意事项

  • 功率限制:器件额定功率仅 250 mW,实际使用时应评估在工作电压与电流下的功耗,并参考厂方功率降额(derating)指南以避免长期过载。对于长期功耗较高的回路,应考虑并联/分流或选择更高功率等级的器件。
  • 温漂管理:虽然 ±100 ppm/°C 的温度系数表现良好,但在高精度应用中仍需考虑温度引起的漂移,并结合电路设计或温度补偿手段来提高稳定性。
  • 阻值公差:±20% 的初始公差较宽,适合粗调场景。若系统要求更高精度,请在设计阶段选择更高精度的型号或在生产线上进行校准并通过后段工序补偿误差。
  • 调节方式与可及性:确认板上调节位置与调整工具的可及性(如十字/一字螺丝刀或专用调节工具),避免使用对焊盘或周边器件造成干扰的调整方式。
  • 焊接与回流:作为 SMD 器件,遵循厂商的回流焊温度曲线与峰值温度限制,避免超过推荐的热循环以防损伤内部可动部件或改变阻值特性。清洗时注意使用对可动接点与粘接材料安全的溶剂。
  • 机械耐久与环境:单圈微调器通常设计用于有限次数的调节操作。若产品需频繁调节,应确认机械寿命及可靠性指标或选择专为多次操作设计的产品。存储与使用环境应避免高湿、高腐蚀性气体与剧烈振动。

五、选型建议

  • 若应用以一次性或少次校准为主、且对阻值精度要求不高,3314G-1-501E 是性价比较高的选择。
  • 若需要更高精度或更低温漂,应优先考虑公差更窄、温度系数更低或多圈/高品质陶瓷/金属膜类微调器件。
  • 对于需要更大功率承受能力的场合,应选择功率额定更高的可调电阻或将功耗分散到外部网络中。

总结:3314G-1-501E 用其小尺寸、SMD 兼容性和稳定的温度特性,适合用于板上校准与偏置调节的众多应用。但在设计中需重点考虑其 250 mW 的功率限制与 ±20% 的阻值公差,合理评估电路要求并结合厂商数据手册进行最终确认与布局。若需更详细的电气、机械参数或推荐的 PCB 封装图样,请参照 BOURNS 官方数据手册。

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