WMSIC Electronic Components

BOURNS SRP7028A-330M

ModelSRP7028A-330M
PackageSMD,7.3x6.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRP7028A-330M
Type
BOURNS
Minimum package
1000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRP7028A-330M
Electronic Component
1
Package
SMD,7.3x6.6mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.864g
Inductor
33uH
Electronic Component
1
Electronic Component
BM0256952453
Electronic Component
AEC-Q200
Current
2A
Resistor(DCR)
200mΩ
Electronic Component
Electronic Component
Electronic Component
1000

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRP7028A-330M 产品概述

一、产品简介

SRP7028A-330M 为 BOURNS 推出的车规级功率电感器,额定电流 2A,电感值 33µH(公差 ±20%),饱和电流 (Isat) 2.5A,直流电阻 200mΩ。SMD 封装,外形尺寸 7.3 × 6.6 mm,符合 AEC‑Q200 车规可靠性要求,适用于对稳态与瞬态电流有较高要求的电源滤波与储能场合。

二、主要参数

  • 电感值:33 µH ±20%
  • 额定电流:2.0 A
  • 饱和电流(Isat):2.5 A
  • 直流电阻(DCR):约 200 mΩ
  • 车规等级:AEC‑Q200(汽车应用可靠性认证)
  • 封装:SMD,尺寸 7.3 × 6.6 mm
  • 品牌:BOURNS

三、产品特性与优势

  • 车规认证:通过 AEC‑Q200,满足汽车电源系统对耐温、抗振以及长期可靠性的严格要求。
  • 高饱和电流:2.5 A 的 Isat 能在突发冲击或负载瞬变时维持良好电感特性,减少饱和带来的性能退化。
  • 低 DCR:约 200 mΩ 的直流电阻有利于降低功耗与发热,提升转换效率。
  • 封装小巧:7.3×6.6 mm 的 SMD 封装便于自动贴装,适合空间受限的板级布局。

四、典型应用场景

  • 汽车电子:车载控制器、传感器供电、车充及车载娱乐系统电源滤波与储能。
  • 开关电源:降压(Buck)/升压(Boost)转换器的储能与输出滤波。
  • 工业与通信:点对点电源模块、LED 驱动电源、隔离电源次级滤波。

五、PCB 布局与散热建议

  • 尽量将电感靠近开关器件与输出电容布置,缩短电流回流路径,减小环路电感。
  • 输出电容与电感间距较小有利于抑制输出纹波;保持良好过孔与散热铜箔,以利热量通过铜箔扩散。
  • 对于高电流应用,避免在电感下方开大面积铜填充且留应力释放空间,减少机械疲劳风险。

六、可靠性与使用注意事项

  • 推荐在厂方指定的回流焊温度曲线下进行焊接,避免过高峰温或重复多次回流,以保护内部绕组和粘结材料。
  • 在超过 Isat 的工作条件下,电感会进入饱和区,电感值急剧下降,应在设计裕量内选择电感规格。
  • 长期高温运行会加速电阻与磁性材料老化,设计时需预留足够热裕量并做好温升评估。

七、封装与订购信息

SRP7028A-330M 为表面贴装器件,常见为卷带包装(具体包装形式与数量请参照 BOURNS 产品手册或向代理商确认)。订购或批量设计前,建议索取并核对器件数据手册与可靠性报告以获得完整的电气测试条件与尺寸公差。

如需更多针对电源拓扑、滤波方案或在特定工况下的仿真建议,可提供应用场景与工作参数以便给出更具体的选型与设计指导。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.