WMSIC Electronic Components

BOURNS 3314J-1-204E

Model3314J-1-204E
PackageSMD,4.5x4.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS 3314J-1-204E
Type
BOURNS
Minimum package
500 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
3314J-1-204E
Electronic Component
1
Package
SMD,4.5x4.5mm
Electronic Component
Resistor / positions
Electronic Component
±20%
Electronic Component
0.432g
Electronic Component
200kΩ
Electronic Component
1
Electronic Component
BM0000003209
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component
Electronic Component
500

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

产品概述:3314J-1-204E 可调电阻/电位器

1. 产品简介

3320J-1-204E 是 BOURNS 旗下的一款高性能、表面贴装型可调电阻/电位器,具有200 kΩ的电阻值和250 mW的功率消耗能力,设计用于各种电子应用。其紧凑的方形封装(4.5mm x 4.5mm x 2.55mm)使得它在空间受限的电路中表现尤为出色。

2. 主要特性

  • 阻值与功率:该元件的标称阻值为200 kΩ,最大功耗能力为0.25W(1/4W),使其适用于广泛的电路设计需求。
  • 容差与稳定性:具备±20%的容差,保证了电阻值的可靠性。同时,具有±100ppm/°C的低温度系数,确保了在不同温度环境中的稳定性。
  • 调节方式:顶部调节设计使得用户在安装后能够方便地进行电阻值的调整,非常适合需要频繁调节的应用。

3. 材料与结构

该电位器采用金属陶瓷材料,具备良好的导电性和耐腐蚀性,确保产品在长时间使用中不易老化或失效。这种材料的应用使得3314J-1-204E在高温和高湿度环境中也能保持优异的性能。

4. 安装和连接

作为一款表面贴装型(SMD)元件,其小巧的尺寸使得它能够便捷地焊接在各种电路板上。这种类型的安装方式可以有效减少电路的占用面积,并提高整体的布局效率。该产品的端接样式为J引线,确保与电路板的牢固连接。

5. 应用场景

3314J-1-204E可广泛应用于多种电子设备中,包括但不限于:

  • 音频设备中的音量和音调调节电路
  • 传感器校准和信号调节
  • 电源管理系统中的电流和电压调节
  • 仪器仪表中用于调节精度和灵敏度

6. 适用的行业

这个可调电阻/电位器适合于多个行业的应用,包括消费电子、医疗设备、汽车电子、通信设备以及工业自动化系统。由于其优异的性能和可靠性,3314J-1-204E成为设计工程师和制造商的理想选择。

7. 竞争产品对比

与其他同类产品相比,3314J-1-204E在温度稳定性和长期可靠性方面表现优异。其紧凑的尺寸和易于调节的设计使其在设计场景中脱颖而出,尤其适合在空间受限的应用中。

结论

BOURNS的3314J-1-204E可调电阻/电位器以其优良的电性能、灵活的调节方式和优雅的设计,为开发高质量、可靠的电子设备提供了强大的支持。无论在消费电子还是工业设备领域,该产品都能满足设计工程师对性能和效率的严苛要求。选择3314J-1-204E,可以确保您的设计在性能与稳定性方面均能达到最高标准。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.