Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3214W-1-103E
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BOURNS 3214W-1-103E
- Type
- BOURNS
- Minimum package
- 250 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 5
- Electronic Component
- 3214W-1-103E
- Electronic Component
- 1
- Package
- SMD,5.1x4.8mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 0.45g
- Electronic Component
- 10kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257053258
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
- Electronic Component
- 250
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
BOURNS 3214W-1-103E 可调电阻（SMD）产品概述
一、产品概述
3214W-1-103E 是 BOURNS 出品的一款表面贴装（SMD）可调电阻/电位器，阻值 10 kΩ，额定功率 250 mW，精度 ±10%，温度系数 ±100 ppm/℃，圈数 5 圈。封装尺寸为 5.1 × 4.8 mm，适合高密度贴片 PCB 的精细调节需求。该型号以稳定的温度特性和多圈精调能力为特点，常用于需要精确微调的电路校准场景。
二、主要参数
- 型号：3214W-1-103E
- 品牌：BOURNS
- 阻值：10 kΩ
- 精度：±10%
- 额定功率：250 mW
- 温度系数：±100 ppm/℃
- 调节圈数：5 圈（多圈，便于细调）
- 封装：SMD，尺寸 5.1 × 4.8 mm
三、特点与优势
- 多圈设计（5 圈）提供更细腻的阻值调节，适合需要精确设定偏置、电压分压或增益的场合。
- ±100 ppm/℃ 的温漂性能保证在温度变化时阻值稳定性较好，有利于长期校准需求。
- 小型 SMD 封装（5.1×4.8 mm）适合现代化紧凑型电子产品与批量自动化生产。
- BOURNS 品牌及工艺保证了元件的可靠性与一致性，便于批量采购与替换。
四、典型应用
- 模拟前端的增益或偏置微调，如放大器、滤波器校准。
- 传感器信号链的零点和量程校准。
- 电源与稳压模块的参考和微调电路。
- 消费电子、仪器仪表、通信设备等需要精细调节的场景。
五、设计与使用建议
- 在实际电路中应考虑环境温度对额定功率的影响，必要时进行功率降额设计以延长寿命。
- 多圈调节虽精细，但避免使用过大力矩操作，推荐使用合适尺寸的调节工具按厂商建议进行调节。
- 贴片焊接及回流工艺应遵循元件热特性与厂方的工艺规范，贴片后如需清洗，应确认清洗剂对该元器件的相容性。
- 对于关键可靠性或长期漂移敏感的设计，建议在样机阶段进行温度循环与长期漂移验证。
六、包装与订购
该型号常见为卷带（tape & reel）包装，便于自动贴装生产。下单时请确认完整型号“3214W-1-103E”、阻值与公差要求，并向供应商确认包装、最低订购量及可追溯性文件。对于特殊环境或行业应用（如工业级、航天级）请咨询厂商获取更详尽的认证与测试数据。
如需替代件、标注图或 PCB 尺寸建议（焊盘布局、丝印定位），可以提供板级设计图，我可协助给出更具体的落位与工艺建议。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
