WMSIC Electronic Components

BOURNS 3214W-1-102E

Model3214W-1-102E
PackageSMD-3P,4.8x3.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS 3214W-1-102E
Type
BOURNS
Unit
Electronic Component
Minimum package
250 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
5
Electronic Component
3214W-1-102E
Electronic Component
1
Package
SMD-3P,4.8x3.5mm
Electronic Component
Resistor / positions
Electronic Component
±10%
Electronic Component
0.344g
Electronic Component
1kΩ
Electronic Component
1
Electronic Component
BM0265113833
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BOURNS 3214W-1-102E 精密微调电位器产品概述

一、产品定位与核心属性

BOURNS 3214W-1-102E是一款工业级贴片式精密微调电位器,隶属于BOURNS经典的3214W系列,专为电子设备中阻值校准、信号调理等需精确调整的场景设计。其核心定位为“小体积、低功耗、稳定可靠”,适配自动化贴装工艺,广泛覆盖消费电子、工业控制、通信等领域。

二、关键参数详解

该产品参数清晰明确,可直接匹配多数应用的基础需求:

  1. 阻值与精度:标称阻值1kΩ(标识代码“102”,即10×10²Ω),精度等级±10%(J级),满足工业级常规校准场景;
  2. 功率容量:额定功耗250mW(0.25W),25℃环境下最大持续工作电压约15.8V(计算:( V=\sqrt{P×R}=\sqrt{0.25×1000}≈15.8V ));
  3. 温度特性:温度系数±100ppm/℃,温度每变化1℃,阻值变化±0.1Ω,适配-55℃至+125℃宽温环境;
  4. 调整特性:5圈调整范围(多圈微调),每圈可调整阻值约200Ω,兼顾精度与调整效率;
  5. 封装与引脚:J型引脚贴片封装,顶部一字槽调整(TOP ADJUST),节省PCB空间,适配SMT工艺。

三、结构设计特点

3214W系列采用成熟金属陶瓷工艺,结构针对可靠性与易用性优化:

  • 电阻元件:采用金属陶瓷电阻膜(Cermet),相比碳膜更耐磨损、抗老化,长期阻值稳定性优异;
  • 调整机构:顶部一字槽设计,内置旋转限位,防止过度旋转划伤电阻膜或损坏机构;
  • 封装材料:耐高温工程塑料(如聚酰胺)封装,可承受回流焊峰值温度(≤260℃),符合SMT工艺要求;
  • 引脚设计:J型引脚表面贴装,焊接可靠性高,抗振动性能优于直插引脚,适配车载、工业振动场景。

四、性能表现与稳定性

该产品性能稳定,满足多数工业与消费场景长期使用需求:

  • 阻值漂移:额定工作条件下,年阻值漂移≤0.1%,减少频繁校准成本;
  • 耐温性能:工作温度范围-55℃至+125℃,宽温环境下阻值变化可控;
  • 抗振动冲击:可承受10G(50-2000Hz)振动与50G(11ms)冲击,适配户外、车载设备;
  • 功耗散热:250mW小功率设计,紧凑体积下散热良好,适合PCB密集贴装。

五、典型应用场景

BOURNS 3214W-1-102E的应用覆盖多个领域,核心场景包括:

  1. 消费电子:手机、平板的电源管理电路校准,音频模块增益微调;
  2. 工业控制:PLC模拟量输入校准,传感器信号调理(温度、压力传感器零点/增益调整);
  3. 通信设备:基站射频电路阻抗匹配,路由器电源模块电压微调;
  4. 汽车电子:车载音响音量/音调调整,低功率传感器信号校准;
  5. 测试仪器:示波器、信号发生器参数校准,万用表精度校准。

六、选型与使用注意事项

为确保性能与可靠性,需注意以下要点:

  1. 选型匹配:确认阻值(1kΩ)、精度(±10%)、功率(250mW)是否匹配应用,避免过载;
  2. 焊接工艺:遵循BOURNS推荐回流焊曲线(预热150-180℃,回流230-250℃,峰值≤260℃),禁止手工焊接(易过热损坏);
  3. 调整操作:用匹配槽口的一字螺丝刀,旋转不超5圈(内置限位),避免用力过大;
  4. 存储条件:存储温度-40℃至+85℃,湿度≤85%,开封后尽快使用,防止受潮;
  5. 额定参数:禁止超最大功耗(250mW)与工作电压(≤15.8V),否则导致阻值漂移或失效。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.