Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3224W-1-100E
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
19
specifications
Core information
- Product name
- BOURNS 3224W-1-100E
- Type
- BOURNS
- Minimum package
- 250 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 12
- Electronic Component
- 3224W-1-100E
- Electronic Component
- 1
- Package
- SMD-3P,4.8x3.5mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 0.448g
- Electronic Component
- 10Ω
- Electronic Component
- 1
- Electronic Component
- BM0257202325
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
- Electronic Component
- 250
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3224W-1-100E 产品概述
一、产品简介
3224W-1-100E 为 BOURNS 出品的小型表面贴装可调电阻（电位器），属于高稳定性微调型器件。该型号以紧凑封装与良好热稳定性著称，适用于对精度和温漂有中等要求且空间受限的电子设备中，用于电路调校、增益/偏置微调与传感器标定等场合。
二、主要技术参数
- 阻值：10 Ω
- 精度（初始容差）：±10%
- 额定功率：250 mW（在规定环境与散热条件下）
- 温度系数：±100 ppm/℃
- 调节圈数：12 圈（微调型，多圈调节实现细腻定位）
- 封装：SMD-3P，外形尺寸 4.8 × 3.5 mm
- 品牌：BOURNS
三、结构与封装说明
3224W-1-100E 为三端表面贴装结构，中心为滑动（或旋转）触点实现阻值调节。SMD-3P 封装适配自动贴装与回流焊工艺，占板面积小、布局灵活。多圈设计（12圈）使调节量细腻、重复定位性能优良，适合需要精确微调的电路调整步骤。
四、性能特点
- 小体积、SMD 可回流焊，便于量产 SMT 组装。
- 12 圈微调结构提供更高的解析度与稳定的定位性，减少调节误差。
- ±100 ppm/℃ 的温度系数在中等温度变化下保持较好阻值稳定性，适合一般工业与消费电子环境。
- 250 mW 的功率等级适用于低功耗微调场合；在较高功耗应用中建议采取适当散热或功率分担措施。
- BOURNS 品质与一致性保证，适合要求批量一致性的设计使用。
五、典型应用场景
- 模拟电路中偏置与增益微调（放大器、滤波器等）。
- 传感器标定与零点校正（温度、压力、光学传感器等）。
- 电源与充放电管理的小范围调节。
- 精密仪器与测试设备的校准电路。
- 空间受限的便携电子产品与通信模块。
六、选型与使用建议
- 由于额定功率为 250 mW，设计时应考虑实际功耗与环境温度对器件的影响，必要时采取功率余量或分流措施。
- 12 圈结构适合追求高解析度的调节场合，但调节速度较单圈更慢，设计时需权衡。
- 贴装与回流焊工艺应遵循 BOURNS 推荐的温度曲线与焊接规范，避免超温或强机械应力影响寿命。
- 在使用中注意避免在功率承受上接近额定值长时间工作，并尽量减少机械冲击与频繁调节以延长接触寿命。
3224W-1-100E 以其紧凑尺寸、稳定温漂与多圈微调特性，适合对体积与调节精度有要求的电路设计，是小功率精密微调应用的可靠选择。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
