Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3214W-1-202E
Configuration
1 options
Configuration
24+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS 3214W-1-202E
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 250 圆盘
Technical parameters
- Power
- 250mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 5
- Electronic Component
- 3214W-1-202E
- Electronic Component
- 1
- Package
- SMD
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 0.74g
- Electronic Component
- 2kΩ
- Electronic Component
- 1
- Electronic Component
- BM0257202354
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3214W-1-202E 产品概述
一、概述
3214W-1-202E 为 BOURNS 品牌的 SMD 可调电阻（电位器），标称阻值 2kΩ，公差 ±10%，额定功率 250mW，温度系数 ±100ppm/℃，五圈调节结构（5 turns）。该器件面向需要精细调节与小型化封装的电子设备，适合贴片焊接的自动化生产线，兼顾体积与可调范围。
二、主要规格
- 阻值：2kΩ（标称）
- 精度：±10%
- 额定功率：250mW（额定条件下）
- 温度系数：±100ppm/℃（典型温漂性能）
- 圈数：5（多圈精细调节）
- 封装：SMD（表面贴装）
三、结构与封装
产品采用表面贴装封装，便于自动贴装与回流焊接。五圈设计提供较大机械行程与更细的电阻调节步进，适用于校准、微调类应用。具体尺寸与焊盘布局请参照厂商数据手册以保证匹配 PCB 布局与可靠性。
四、性能特点
- 多圈结构提高调节精度与重复性，便于精确设定电路工作点；
- 低温漂（±100ppm/℃）确保在宽温度范围内的稳定性，适用于对温度敏感的模拟电路；
- 250mW 的功率等级适合信号级与控制级电路调节，非大功率功率衰减场合；
- SMD 兼容性强，利于高密度板面设计与自动化生产。
五、典型应用
适用于精密信号调校、放大器偏置、传感器零点/量程校准、通讯设备微调、电源与参考电压微调、仪器仪表及消费电子中的参数设定场景。
六、安装与使用建议
- 推荐在 PCB 设计时遵循厂商焊盘及过孔规范，并保留适当的机械支撑区；
- 调节过程避免过大扭矩与频繁剧烈振动，防止触点损伤或回差增大；
- 回流焊工艺需参照生产商的温度曲线，避免超出推荐的焊接温度与时长；
- 如用于长期设置，应在调节后固定位置或选择有锁定功能的方案。
七、采购与质量保证
选购时请确认完整型号（3214W-1-202E）及供应商资质，索取并核对数据手册、可靠性报告与 RoHS 合规证书。如需批量采购或定制筛选（阻值筛选、回差等级），建议与 BOURNS 官方或授权代理联系以获得技术支持与一致性保证。
注：本文依据提供的基础参数整理，具体电气与机械参数、寿命、环境适应性等以 BOURNS 官方数据手册为准。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
