Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3386P-1-103TLF
Configuration
1 options
Configuration
26+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS 3386P-1-103TLF
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 100 管
Technical parameters
- Power
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 1
- Electronic Component
- 3386P-1-103TLF
- Electronic Component
- 1
- Package
- Through-hole-3P, 9.5x9.5mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 1.04g
- Electronic Component
- 10kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264354624
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3386P-1-103TLF 产品概述
一、产品简介
3386P-1-103TLF 为 BOURNS 品牌的可调电阻（电位器/修调电位器），属单圈（1圈）三端插件式结构，外形尺寸约 9.5×9.5mm。产品设计用于电路微调与标定场合，具有小体积、稳定性好且便于 PCB 插件安装的特点。TLF 为型号后缀，具体安装形式与调整方向请参照官方数据手册确认。
二、主要技术参数
- 阻值：10kΩ（标称）
- 精度（初始容差）：±10%
- 功率额定：500mW（环境与散热条件相关）
- 温度系数（TCR）：±100 ppm/℃
- 圈数：1（单圈）
- 引脚：三端（插件-3P）
- 尺寸：约 9.5×9.5 mm
以上参数为设计基准，具体环境极限与寿命指标以厂方 datasheet 为准。
三、核心特点与优势
- 小型化封装，适合空间受限电路板上的调节和校准。
- ±100 ppm/℃ 的温漂在小信号微调场合能提供较好的温度稳定性。
- 500mW 的功率等级适合信号级和低功率控制回路中的反复微调。
- 三端结构可用作电位器或作为可变电阻器使用，应用灵活。
- BOURNS 品牌保证了量产一致性与可靠的制造工艺。
四、典型应用场景
- 仪器仪表的零点/增益微调与校准。
- 模拟前端及放大器偏置、反馈回路微调。
- 参考电压、滤波网络及温度补偿电路的可调电阻。
- 通用消费电子、小型控制板以及研发样机的调试与设定。
五、安装与使用建议
- PCB 布局预留标准三孔插件孔距并考虑螺丝或挡位固定，避免机械应力传递到引脚。
- 在高功率或高温环境使用前，确认实际散热情况以免超出 500mW 额定功率。
- 调整时建议使用合适尺寸的调节工具，避免损伤调整轴或导致接触不良。
- 量产时建议按批次抽测阻值与温漂以保证一致性。
六、选型与替代件
选择时除阻值与功率外，应关注调整方式（顶调/侧调）、安装形式与机械寿命。若需更高精度或更高功率，可参考 BOURNS 其它系列或同类厂商的高功率/高精度修调电位器。替代件时请比对封装、脚位、TCR 与功率等级。
七、采购与质量注意事项
订购前请索取并确认最新 datasheet，核对 TLF 后缀对应的安装与调节方向。批量采购建议要求出货检验报告（阻值分布、温漂与耐久性测试）。如用于关键或长期运行设备，建议与供应商确认长期供货与替代方案。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
