Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3362W-1-502LF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS 3362W-1-502LF
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 50 管
Technical parameters
- Power
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 1
- Electronic Component
- 3362W-1-502LF
- Electronic Component
- 1
- Package
- Through-hole-3P, 7x6.6mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 0.72g
- Electronic Component
- 5kΩ
- Electronic Component
- 1
- Electronic Component
- BM0264532942
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3362W-1-502LF 产品概述
一、产品简介
3362W-1-502LF 是 BOURNS 推出的单圈可调电阻（电位器）元件，额定功率 500mW，阻值 5kΩ，公差 ±10%，温度系数 ±100ppm/℃，圈数为 1 圈。封装为插件型（3P 引脚），外形近似 7 x 6.6mm，适用于电路板穿孔安装的精密微调场合。
二、主要技术参数
- 阻值：5 kΩ（标称）
- 精度（公差）：±10%
- 额定功率：500 mW（在规定环境温度下）
- 温度系数：±100 ppm/℃（良好的热漂移控制，适合有温度稳定性要求的应用）
- 圈数：1（单圈调节，便于快速微调）
- 引脚/封装：插件型 3 引脚，安装占位约 7 x 6.6 mm
- 品牌：BOURNS，型号：3362W-1-502LF
三、主要特点与优势
- 稳定性：±100 ppm/℃ 的温度系数使得阻值随温度变化较小，利于精确偏置与校准。
- 小尺寸插件封装：7×6.6mm 小体积，适合空间受限的 PCB 布局与穿件安装。
- 单圈结构：调节直观、响应快，适合做零点、增益或分压微调。
- 通用电气规格：5kΩ、500mW 的组合适合模拟电路、信号调整及低功率偏置场合。
四、典型应用场景
- 模拟电路的偏置与增益微调（运放、滤波器）
- 传感器与测量系统的零点/量程校准
- 电源模块中低功率参考电压或分压调整
- 消费电子、工业控制板上的现场微调与维护
五、使用建议与注意事项
- 功率与热管理：在接近额定功率工作时应考虑降额使用或采取散热/限流措施以延长寿命，建议在实际设计中留有余量。
- 焊接与安装：为避免长时间高温损伤元件，请遵循制造商的焊接工艺规范，尽量缩短焊接时间并控制峰值温度。
- 环境与可靠性：避免长时间暴露在高湿、高腐蚀气氛中；在有强振动或机械冲击的场合，应做好固定与应力缓冲。
- 调节使用：单圈设计适合频繁微调，但不建议在带电或含高频干扰的环境中频繁手动旋动以免引入噪声或接触不良。
六、采购与替代
3362W-1-502LF 属于 BOURNS 系列可调电阻中的通用型号，采购时请确认封装形式（插件-3P）、阻值与功率规格。若需更高精度或不同阻值、不同功率等级，可在同系列或其他厂商的三针单圈电位器中选择替代型号，注意比对温漂、额定功率和机械尺寸。
总结：3362W-1-502LF 以其小体积、可调性和温漂控制优势，适用于电路微调与校准需求，在设计中合理考虑功率余量和焊接工艺可获得稳定可靠的长期性能。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
