WMSIC Electronic Components

BOURNS 3224X-1-103E

Model3224X-1-103E
PackageSMD-3P,4.8x3.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS 3224X-1-103E
Type
BOURNS
Unit
Electronic Component
Minimum package
200 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
12
Electronic Component
3224X-1-103E
Electronic Component
1
Package
SMD-3P,4.8x3.5mm
Electronic Component
Resistor / positions
Electronic Component
±10%
Electronic Component
0.318g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0264528769
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BOURNS 3224X-1-103E 可调电阻(电位器)产品概述

一、产品定位与核心应用方向

BOURNS 3224X-1-103E是一款小型化贴片多圈可调电位器,属于BOURNS 3224X系列,主打「小体积、精细调节、稳定可靠」三大核心优势,适配对空间紧凑性、阻值精度及温度稳定性有要求的各类电子电路,覆盖工业控制、消费电子、通信、仪器仪表等多个领域,是实现电路参数微调(如信号增益校准、电压基准调整、传感器零点校准)的常用元件。

二、关键技术参数详细解析

该型号参数明确,可满足多数中小功率电路的微调需求:

  1. 阻值与精度:标称阻值10kΩ(标识「103」,即10×10³Ω),精度±10%,属于工业级通用精度范围,可覆盖非超精密调谐的场景;
  2. 功率额定值:250mW(0.25W),25℃环境下可稳定承载额定功率,多数小信号电路无需额外降额,使用便捷;
  3. 温度稳定性:温度系数±100ppm/℃,即温度每变化1℃,阻值变化±1Ω(计算:±100×10⁻⁶×10kΩ),宽温范围内漂移可控;
  4. 调节特性:12圈多圈设计,每圈调节分辨率约833Ω,相比单圈电位器可实现更精细的参数控制;
  5. 封装与引脚:SMD-3P(3引脚表面贴装),尺寸4.8×3.5mm,适配高密度PCB布局,3引脚(两端固定端+中间滑动端)符合常规电路连接逻辑。

三、封装与结构设计特点

  1. SMD封装优势:表面贴装兼容自动化生产,焊接可靠性高,减少人工插件误差,同时节省PCB空间,适合高密度电路设计;
  2. 紧凑结构:采用陶瓷基体(同系列常见材料),提升温度稳定性及机械强度,12圈传动机构集成度高,无额外体积占用;
  3. 引脚可靠性:3引脚布局适配常规贴片焊盘,焊接后机械连接牢固,抗振动能力优于插件电位器。

四、可靠性与环境适应性

该型号在可靠性方面具备以下特点:

  • 宽温稳定性:±100ppm/℃的温度系数确保-55℃~125℃(参考同系列常见规格)范围内阻值漂移小,适配高低温场景;
  • 功率降额兼容:250mW额定功率若环境温度升高(如超25℃),可按「每升高10℃降额5%」调整,满足实际应用需求;
  • 抗干扰能力:SMD封装减少引脚外露,降低电磁干扰影响,陶瓷基体具备一定抗腐蚀能力,适合潮湿、粉尘较少的工业环境。

五、典型应用场景

  1. 工业控制:PLC输入/输出模块微调、压力/温度传感器零点校准;
  2. 消费电子:小型音箱音量/音调微调、智能家电控制板参数设置;
  3. 通信设备:WiFi/蓝牙模块信号调谐、DC-DC转换器输出电压微调;
  4. 仪器仪表:示波器/万用表校准电路、小型测试设备参数设置;
  5. 汽车电子:倒车雷达传感器校准、车身控制模块微调(需确认是否符合AEC-Q200汽车级标准)。

六、选型与使用注意事项

  1. 选型匹配:若需更高精度(如±5%),可选同系列精度升级型号;若功率需求更大,需更换500mW及以上电位器;
  2. 焊接规范:遵循IPC-A-610标准,回流焊峰值温度不超260℃,避免过热损坏调节机构;
  3. 调节操作:多圈调节需缓慢转动,避免机械磨损;调节后建议用硅胶固定,防止振动导致阻值漂移;
  4. 存储条件:存储温度-40℃~85℃,相对湿度≤85%,避免阳光直射及化学腐蚀环境。

总结:BOURNS 3224X-1-103E以小体积、多圈精细调节、稳定可靠为核心优势,适配多种电路场景,是工业及消费电子领域实现参数微调的高性价比选择。

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