WMSIC Electronic Components

BOURNS SRR1005-4R7M

ModelSRR1005-4R7M
PackageSMD,12.7x10mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRR1005-4R7M
Type
BOURNS
Minimum package
600 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRR1005-4R7M
Electronic Component
1
Package
SMD,12.7x10mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
0.079g
Inductor
4.7uH
Electronic Component
1
Electronic Component
BM0257688425
Current
2.5A
Resistor(DCR)
40mΩ
Electronic Component
Electronic Component
Electronic Component
600
and Current(Isat)
3.8A

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRR1005-4R7M — BOURNS 4.7µH 功率电感 产品概述

一、产品简介

SRR1005-4R7M 是 BOURNS 推出的表面贴装功率电感,标称电感值为 4.7µH,精度 ±20%,面向开关电源、降压转换器及电源滤波场景。器件为 SMD 结构,外形尺寸 12.7 × 10 mm,适合空间受限但需要较大电流能力的电源路径设计。

二、主要规格

  • 电感值:4.7 µH(±20%)
  • 额定电流:2.5 A(长期工作条件下的推荐电流)
  • 饱和电流(Isat):3.8 A(磁芯开始显著饱和时的参考值)
  • 直流电阻(DCR):约 40 mΩ
  • 封装形式:SMD,外形 12.7 × 10 mm
  • 品牌:BOURNS
    (以上参数以元器件铭牌/采购信息为准,设计时建议参考厂商完整数据手册)

三、特性与优点

  • 大电流能力:额定电流 2.5A,可承受短时或脉冲峰值接近 3.8A 的负载,适用于中小功率降压模块。
  • 体积与性能的平衡:12.7×10mm 的 SMD 封装在占板面积受限的场合仍能实现较低 DCR 与良好电流承载。
  • 低 DCR 降低损耗:约 40 mΩ 的直流电阻在额定电流下有助于限制 I²R 损耗(例如在 2.5A 时损耗约 0.25 W)。
  • 良好滤波效果:适用于输入输出滤波、能量储存及纹波抑制。

四、典型应用

  • DC-DC 降压(buck)转换器电感
  • 电源模块与模块化电源滤波器
  • 工业与通信设备的电源管理
  • 汽车电子(需结合温度与可靠性验证)及便携设备电源方案

五、使用注意与选型建议

  • 电流管理:长期工作电流建议不超过额定电流 2.5A,设计中对峰值或脉冲电流应考虑磁饱和影响及电感下降,靠近或超过 Isat(3.8A)时电感会明显减小,可能影响环路稳定性。
  • 温升与散热:计算 I²R 损耗并评估 PCB 散热条件,必要时通过铜箔加宽或加散热层降低温升。
  • 纹波电流:在高纹波或高工作频率下,电感值会随直流偏置和频率变化,建议参考实际测量或厂商曲线。
  • 选型对比:若需更小 DCR 或更高电流,可寻求同系列或其它型号的更大规格;若空间更受限,可考虑牺牲部分电流能力选择更小封装。

六、封装与安装建议

  • 焊接工艺:按厂商推荐的回流焊温度曲线与焊盘尺寸布局进行,避免过热导致性能变化或机械损伤。
  • PCB 布局:电感与开关器件、二极管、输出电容尽量靠近布置,减少回流环路面积;加宽进出线铜箔以降低寄生电阻。
  • 可靠性:贴片前检查焊膏、回流曲线及器件极性/方向(如适用),并在样机阶段做热/振动/循环测试验证。

七、订购与识别

  • 型号:SRR1005-4R7M(以订单/物料单为准)
  • 品牌:BOURNS
  • 采购时注意:确认包装形式(卷装/托盘)、批次与可追溯的生产数据以便可靠性管控;如需关键应用(汽车、医疗等),建议向厂商索取更详尽的认证与规格文件。

如需更详尽的电感曲线(频率响应、直流偏置下的电感随电流变化曲线)、推荐 PCB 焊盘图或环境/温度极限,请告知,我可以帮助查找或整理更完整的设计资料。

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