WMSIC Electronic Components

BOURNS 3224J-1-502E

Model3224J-1-502E
PackageSMD-3P,4.6x3.5mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS 3224J-1-502E
Type
BOURNS
Unit
Electronic Component
Minimum package
500 圆盘

Technical parameters

Power
250mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
12
Electronic Component
3224J-1-502E
Electronic Component
1
Package
SMD-3P,4.6x3.5mm
Electronic Component
Resistor / positions
Electronic Component
±10%
Electronic Component
0.22g
Electronic Component
5kΩ
Electronic Component
1
Electronic Component
BM0257202367
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3224J-1-502E 产品概述

一、产品简介

3224J-1-502E 为 BOURNS 出品的小型可调电阻(电位器),属 SMD 形式的多圈精密调整元件。基础参数为阻值 5 kΩ、精度 ±10%、额定功率 250 mW、温度系数 ±100 ppm/℃,圈数 12 圈,封装标注为 SMD-3P,外形尺寸约 4.6 × 3.5 mm。该器件以紧凑体积和多圈微调特性适用于需要精确阻值设定且占板空间受限的电路。

二、主要特性

  • 阻值:5 kΩ,常用于电压分压、偏置和增益微调。
  • 精度:±10%,满足一般调整与容差补偿需求。
  • 功率:250 mW(表征器件在规定环境下的最大耗散能力,实际设计中建议适当余量)。
  • 温度系数:±100 ppm/℃,温漂较低,有利于温度稳定性的要求场合。
  • 圈数:12 圈,提供较细的调节分辨率,便于精确设定与重复定位。
  • 封装与尺寸:SMD-3P,4.6×3.5 mm,适合表面贴装工艺,节省空间。

三、典型应用场景

  • 精密模拟电路的偏置与零点调节。
  • 放大器增益和滤波器截止频率微调。
  • 电源电压参考与恒流源校准。
  • 消费电子、通信设备、工业控制板上用于出厂校准或现场调整的方案。

四、安装与使用建议

  • 贴装:采用标准表面贴装流程,焊接时参照制造商的回流焊温度曲线;避免过高温度和过长回流时间以防性能退化。
  • 板上布局:为便于调整留出拨动或旋具作用区域;焊盘尺寸与距位应按厂方推荐图样设计以保证可靠焊接。
  • 散热与功率:250 mW 为额定耗散,实际使用中建议留有裕量并注意器件周围热源,必要时做功率降额处理。
  • 调整:12 圈设计适用于精细调节,应使用合适尺寸的调整工具,避免过大力矩损伤调节机构。
  • 清洁与可靠性:避免使用强腐蚀性清洗剂直接喷洗,若需清洁以低水分溶剂为宜;存储与装配注意防潮防静电。

五、选型提示

  • 若需要更高精度或更低温漂,可考虑容差更窄或更低 ppm/℃ 的型号;若调整频繁或要求快速响应,可选择单圈大行程型号。
  • 在功率接近额定值的应用中,优先选择额定功率更高或增加散热设计的方案。
  • 对空间极为严格的产品,3224J-1-502E 的微型 SMD 封装能有效节省 PCB 面积。

六、总结

3224J-1-502E 以其多圈高分辨率、紧凑 SMD 封装及适中的温漂与功率特性,适合用于精密调校与占板面积受限的电子设计。选型与布局时应综合考虑功率裕度、调节频率与温度稳定性,按制造商推荐的安装与焊接规范操作,可获得稳定且可重复的调节效果。若需最终电气与机械图纸、回流规范或可靠性数据,建议参考 BOURNS 官方数据手册或向供应商索取详细资料。

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