WMSIC Electronic Components

BOURNS 3329H-1-103LF

Model3329H-1-103LF
PackageThrough-hole
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

20 specifications

Core information

Product name
BOURNS 3329H-1-103LF
Type
BOURNS
Unit
Electronic Component
Minimum package
50 管

Technical parameters

Power
500mW
Electronic Component
Electronic Component
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
3329H-1-103LF
Electronic Component
1
Package
Through-hole
Electronic Component
Resistor / positions
Electronic Component
±10%
Electronic Component
0.45g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0265637813
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3329H-1-103LF 产品概述

一、产品简介

3329H-1-103LF 是 BOURNS(博恩斯)出品的一款单圈可调电阻(电位器),为插件(通孔)式结构,适用于电路调试与参数校准。器件外形紧凑,便于电路板安装与现场微调,常用于模拟电路、传感器调零与信号调节场合。

二、主要参数

  • 阻值:10 kΩ(103 表示 10k)
  • 精度(标称容差):±10%
  • 最大功率:500 mW(在额定环境温度下)
  • 温度系数:±100 ppm/℃
  • 圈数:1(单圈)
  • 安装形式:插件(通孔)
  • 品牌:BOURNS

三、特性与优势

  • 可靠的阻值调整能力,满足一般电路的微调需求;
  • 500 mW 功率等级适合低功率信号与偏置回路使用;
  • ±100 ppm/℃ 的温度系数在温变条件下能维持较好的阻值稳定性;
  • 单圈结构简洁,便于快速调节与锁定,适合调试与出厂校准;
  • 通孔插件方式便于传统波峰/手工焊接与机械固定,安装稳固。

四、典型应用

  • 精密放大器的偏置与增益调整;
  • 传感器零点/量程微调;
  • 电源参考与分压器调节;
  • 示波器、仪表等测试设备的校准与调节。

五、使用与安装建议

  • 遵循额定功率限制,必要时考虑功率去等级(derating)以应对高温环境;
  • 焊接时控制焊接温度与时间,避免高温损伤内部轨道与粘结材料;
  • 避免在高湿或腐蚀性气氛中长期工作,必要时采取密封或防护措施;
  • 调节时避免过大扭矩或频繁强力转动,减少机械磨损。

六、选型与注意事项

选择时除阻值与功率外,应关注环境温度范围、机械寿命与是否需要可锁定结构。如需更高精度、耐温或长寿命的调整件,可考虑更高规格或多圈可调电阻。3329H-1-103LF 以其简洁可靠的特性,适合绝大多数常规电子调节场景。

Request for quote

Send RFQ

Use the form for single models, category sourcing, and multi-line BOM requirements.

Send your target model and quantity.

Product sourcing intelligence

Model, package, availability, and BOM fit reviewed before quotation.

WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.

Electronic component model and package intelligence review on an ESD-safe inspection bench

Model & package intelligence

Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.

BOM matching and alternative component comparison workstation with protected IC samples

BOM matching & alternatives

BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.

Electronic component sourcing availability dashboard with ESD-protected samples

Sourcing availability signal

Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.

Buyer sourcing scenarios

Examples of how common component sourcing requests are organized.

Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.

The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.

Package confirmation Typical RFQ workflow

A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.

Mixed BOM triage Typical RFQ workflow

The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.

Obsolete-part review Typical RFQ workflow

Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.

Small-batch request Typical RFQ workflow

Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.

Repair batch evidence Typical RFQ workflow

When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.

Model suffix clarification Typical RFQ workflow

Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.

Export handoff Typical RFQ workflow

The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.

Replenishment inquiry Typical RFQ workflow

Related products

Packaged components ready for RFQ.