WMSIC Electronic Components

BOURNS 3362P-1-103TLF

Model3362P-1-103TLF
PackageThrough-hole-3P, 7x6.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS 3362P-1-103TLF
Type
BOURNS
Minimum package
50 管

Technical parameters

Power
500mW
Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
1
Electronic Component
3362P-1-103TLF
Electronic Component
1
Package
Through-hole-3P, 7x6.6mm
Electronic Component
Resistor / positions
Electronic Component
±10%
Electronic Component
0.785g
Electronic Component
10kΩ
Electronic Component
1
Electronic Component
BM0264500954
Electronic Component
±100ppm/℃
Electronic Component
Electronic Component
Electronic Component
50

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

3362P-1-103TLF 产品概述

一、产品简介

BOURNS 3362P-1-103TLF 是一款小型单圈可调电阻(电位器/修调电位器),标称阻值为 10 kΩ,公差 ±10%,额定耗散功率 500 mW,温度系数 ±100 ppm/°C,圈数为单圈(1 turn)。封装为插件式三脚(插件-3P),外形尺寸约 7 × 6.6 mm,适合 PCB 插装后作为精度调节或校准元件使用。该器件以紧凑体积和稳定的电性能,常用于需要频繁调整或调试的电路板上作为微调元件。

二、主要规格要点

  • 阻值:10 kΩ(标称)
  • 精度(公差):±10%
  • 额定功率:500 mW(环境温度和散热条件合规时)
  • 温度系数:±100 ppm/°C(反映随温度变化的阻值稳定性)
  • 圈数:1(单圈调节)
  • 接脚/封装:插件式 3 引脚,封装尺寸约 7 × 6.6 mm
  • 品牌:BOURNS(品质与可靠性良好)

三、功能与适用场景

3362P-1-103TLF 作为小功率精密调节元件,适合用于下列场景:

  • 电路初期调试与生产校准(如零点、增益、偏置调整)
  • 模拟前端微调:运放增益/偏置、滤波器中心频率微调
  • 传感器/测量系统的标定(如桥路平衡、灵敏度微调)
  • 低功率信号路径中的电平调整和分压应用 该器件不适合用作大功率或高电流环境下的主负载元件,应用于信号级或控制级的微调。

四、性能与使用注意

  • 功率与散热:500 mW 为器件在标准环境下的最大耗散能力。若在高温或封装密集的 PCB 上使用,应适当降低实际功率(留有余量),并避免长期满载工作以延长寿命。
  • 温度稳定性:±100 ppm/°C 的温度系数意味着在温度变化时阻值变化较小,适用于对温漂有一定要求的应用,但对超高精度(如 ppm 级别)场合仍需选择更低 TCR 的元件。
  • 公差与精度:±10% 的初始公差适合常见调试场合;若需要更精确的最终阻值,应考虑在调整后进行配套测量或选择公差更小的型号。
  • 单圈特性:单圈调节适用于快速调节与定位,不适于需要非常细致、缓慢调节的场合(此类场合通常选用多圈电位器)。

五、安装与焊接建议

  • PCB 布局:在 PCB 设计时预留足够的空间以利于操作与调节,3 引脚布局按制造商推荐的封装图纸设计孔位。
  • 焊接工艺:推荐采用手工焊接或温和的回流/波峰焊参数,避免过高温度和过长时间的热冲击。焊接时尽量减少对器件本体的机械应力。
  • 操作与调整:在调整时使用合适的调节工具(小螺丝刀或专用调节笔),避免用力过猛导致传动机构磨损或损坏。调节完成后可在必要位置涂覆适量保护胶防止震动造成位置漂移。

六、典型电路应用

  • 电位器作分压器:将三脚用于输入、输出与地,实现可调分压。
  • 电阻式微调:用作电路中某一路串联或并联的可变电阻,用于修正零点或微调增益。
  • 运放反馈回路:在运算放大器反馈网路中作为可调电阻,用以设定或微调放大倍数。

七、选型提示与补充信息

  • 若对稳定性、精度或温漂有更高要求,可考虑选择更低 TCR、更小公差或多圈型号。
  • 若需要承受更高功率或长期工作,选择更高功率额定值(W)或更大封装形式的电位器。
  • 在最终设计与采购前,请参阅 BOURNS 官方数据手册,确认机械尺寸、引脚间距、最大调整力矩、寿命(旋转次数)、接触电阻等详细参数,以保证与 PCB 设计和使用要求完全匹配。

总结:3362P-1-103TLF 以其小巧的插件封装、稳定的温漂特性和适用的功率等级,是常见电子产品中用于校准与调试的理想选择。正确的安装、合适的应用场景与合理的功率控制将有助于发挥其最佳性能。

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