WMSIC Electronic Components

BOURNS SRP1770TA-220M

ModelSRP1770TA-220M
PackageSMD,16.9x17.6mm
BrandBOURNS
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 25+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BOURNS SRP1770TA-220M
Type
BOURNS
Minimum package
200 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BOURNS
Electronic Component
SRP1770TA-220M
Electronic Component
1
Package
SMD,16.9x17.6mm
Electronic Component
Power Inductor
Electronic Component
±20%
Electronic Component
11.9g
Inductor
22uH
Electronic Component
1
Electronic Component
BM0227100587
Electronic Component
AEC-Q200
Current
12A
Resistor(DCR)
26.5mΩ
Electronic Component
Electronic Component
Electronic Component
200

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

SRP1770TA-220M 产品概述

一、产品简介

SRP1770TA-220M 为 BOURNS 出品的屏蔽绕线功率电感,电感量 22 µH,公差 ±20%。本器件为表面贴装(SMD)封装,外形尺寸约 16.9 × 17.6 mm,专为需要大电流、低损耗和优秀电磁兼容性的电源应用设计。该型号为非标准/定制类型,适用于对体积、热管理与电流能力有较高要求的系统。

二、主要电气参数

  • 电感值:22 µH(±20%)
  • 额定电流:12 A(连续工作推荐值)
  • 饱和电流 Isat:18 A(典型饱和特性时限)
  • 直流电阻 DCR:最大 26.5 mΩ
  • 车规等级:符合 AEC‑Q200 要求

三、产品特点与优势

  • 高电流承载能力:12 A 额定和 18 A 饱和电流,适合大电流直流-直流变换器与功率滤波。
  • 低 DCR:26.5 mΩ 的低直流电阻可降低铜损,提升转换效率并减小发热。
  • 屏蔽绕线结构:有效抑制外泄磁场与耦合干扰,利于系统 EMC 设计。
  • SMD 封装:适配自动化贴装与回流焊工艺,便于批量生产与可靠连接。
  • 车规级可靠性:遵循 AEC‑Q200,适合车载电子与严苛环境下使用。

四、典型应用场景

  • 汽车电子电源模块(车载 ECU、信息娱乐、ADAS 电源)
  • DC‑DC 降压/升压转换器的输出滤波与储能环节
  • 电机驱动与电源管理模块
  • LED 驱动与工业电源系统

五、使用与布局建议

  • 连续工作电流建议不要长期接近额定值,应考虑一定的热/寿命余量并进行必要的散热设计。
  • PCB 布局时在电感两端采用较宽铜带并增加过孔过厚铜层,提高散热与电流承载能力;避免电感紧邻高温元件。
  • 关注磁饱和效应:当瞬时电流接近或超过 Isat,电感量会下降,应在电路设计中考虑峰值电流与过载保护。
  • 在高频开关场合配合适当的滤波与旁路电容以保证稳定性与低噪声性能。

六、采购与技术支持

型号:SRP1770TA-220M,品牌:BOURNS。因为为非标准/定制件,建议在采购前向供应商确认规格书、样品可得性及焊接工艺要求;必要时联系厂商获取完整的机械图、温升曲线与可靠性测试报告。

如需更详尽的电气特性曲线、温升数据或应用参考电路,我可协助整理并给出 PCB 布局与热管理的具体建议。

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