Model & package intelligence
Model text, package form, tray or reel details, and visual evidence are reviewed together before RFQ feedback.
BOURNS 3362P-1-203LF
Configuration
1 options
Configuration
25+
Available for RFQ
Technical data
Product details
20
specifications
Core information
- Product name
- BOURNS 3362P-1-203LF
- Type
- BOURNS
- Unit
- Electronic Component
- Minimum package
- 50 管
Technical parameters
- Power
- 500mW
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- Electronic Component
- BOURNS
- Electronic Component
- 1
- Electronic Component
- 3362P-1-203LF
- Electronic Component
- 1
- Package
- Through-hole-3P, 7x6.6mm
- Electronic Component
- Resistor / positions
- Electronic Component
- ±10%
- Electronic Component
- 0.58g
- Electronic Component
- 20kΩ
- Electronic Component
- 1
- Electronic Component
- BM69414306
- Electronic Component
- ±100ppm/℃
- Electronic Component
- Electronic Component
For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.
3362P-1-203LF 产品概述
一、产品简介
3362P-1-203LF 是一款高性能的可调电阻器/电位器，属于 Bourns 公司生产的 3362 系列产品。该电位器具有 20 kΩ 的电阻值，工作功率为 0.5W（即 500mW），适合用于各种电子电路的调节和控制应用。其具备 ±10% 的电阻容差与 ±100ppm/°C 的温度系数，确保了其在不同工作环境下提供稳定、可靠的性能。此外，3362P 系列的设计与材料选择使其在电气性能与机械强度方面都具备较高的稳定性。
二、产品特性
电阻值与功率：3362P-1-203LF 的电阻值为 20 kΩ，适用于需要中等阻值调节的电路。这种电阻值广泛应用于音频、信号调节与反馈路径中，能够精准控制信号的强度与频率。
功率处理能力：其额定功率为 0.5W，确保了在普通工作条件下，可以安全、稳定地运行。这一功率配置适合大多数低功率电路，能够高效满足设计需求。
容差与温度系数：产品的 ±10% 的电阻容差保证了其在实际应用中拥有足够的灵活性，而 ±100ppm/°C 的温度系数则进一步增强了其在温度变化时的抗干扰能力，适合不同温度环境的应用。
调节类型：该电位器采用顶部调节方式，方便用户进行手动调整，适合不同需求场合下的使用。这种设计还可以减小体积，提高电路的密度。
封装与尺寸：3362P-1-203LF 的封装为 3362P，尺寸为 6.99mm x 6.60mm x 4.70mm（矩形），其紧凑的设计使其非常适合应用在空间有限的电子设备中。
安装方式：该产品采用通孔安装，具有良好的机械固定性。在许多传统的电路设计中，通孔安装方式依然是主流，确保了电路板的可靠性与稳定性。
材料与耐久性：其电阻材料为金属陶瓷，确保了良好的热稳定性和长久的使用寿命。金属陶瓷材料在高温与高湿环境下也能表现出优异的性能，加强了产品在工业应用中的可靠性。
三、应用场景
3362P-1-203LF 可调电位器广泛应用于各个行业的电子设备中，包括但不限于：
- 消费电子：如音响设备、电视机等，作为音量和调节信号的控制元件。
- 工业控制：在机械设备的控制面板上，用于参数调整以及信号反馈。
- 自动化设备：在机器人与自动化生产线中，用于调整传感器灵敏度与反馈效能。
- 通讯设备：在无线电通信和信号处理设备中，用于抗干扰信号调节。
四、总结
综上所述，3362P-1-203LF 是一款结构紧凑、性能可靠的可调电阻器，具备高功率处理能力、优良的电气性能以及良好的温度特性，适合广泛的应用领域。Bourns 公司经过多年的技术积累与创新，为用户提供了先进的电气解决方案，使得这一产品成为电子设计中不可或缺的重要组成部分。无论是在消费电子还是工业领域，3362P-1-203LF 都能有效满足用户对可靠性、稳定性与灵活性的要求。
Request for quote
Send RFQ
Use the form for single models, category sourcing, and multi-line BOM requirements.
Product sourcing intelligence
Model, package, availability, and BOM fit reviewed before quotation.
WMSIC turns product data, package visuals, BOM context, and sourcing signals into practical RFQ notes for buyers.
BOM matching & alternatives
BOM lines are compared by package, parameters, quantity, and workable alternatives for cleaner sourcing decisions.
Sourcing availability signal
Stock routes, quotation confidence, lead-time notes, and shipment feasibility are checked before sales follow-up.
Buyer sourcing scenarios
Examples of how common component sourcing requests are organized.
Typical RFQ scenarios based on the WMSIC form fields, catalog data, manual review steps, and shipment preparation workflow.
The buyer shares the full part number, package requirement, quantity, destination, and available product photos so the quotation can record the exact version under review.
A multi-line BOM is organized into direct sourcing lines, lines that need package clarification, and lines where alternative-part review is permitted.
The original manufacturer part number, datasheet revision, application, critical limits, and acceptable changes are collected before possible candidates are discussed.
Sample quantity, minimum packing, package format, target date, and courier destination are kept together in one RFQ conversation.
Package photos, model markings, board context, and the quantity needed for repair help focus the sourcing review on the relevant version.
When a suffix or package note is incomplete, the response records the open difference and requests buyer confirmation before procurement proceeds.
Packing format, carton notes, invoice details, courier option, destination, and tracking handoff are coordinated around the confirmed order.
The request connects the previously used model, current demand, package evidence, target timing, and replenishment sourcing route.
Related products
Packaged components ready for RFQ.
1 Piece BGA Integrated Circuit Chipset MN864739 CXD90061GG CXD90062GG PS5 QFN-80
- Model
- MN864739
- Package
