WMSIC Electronic Components

BHFUSE BSMD0402L-010C BSMD0402L

ModelBSMD0402L-010C
Package0402
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0402L-010C
Type
BHFUSE
Minimum package
10000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0402L-010C
Electronic Component
1
Electronic Component
0.65mm
Package
0402
Electronic Component
Resettable Fuse
Electronic Component
0.017g
Electronic Component
1.15mm
Electronic Component
1mm
Electronic Component
1
Electronic Component
500ms
Electronic Component
BM0264819694
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
6V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0402L-010C 产品概述

一、主要性能特点

BSMD0402L-010C 是一款面向便携设备与工业控制的高可靠性片式自恢复保险元件(PTC/热敏自恢复保护器件),封装为 0402(标称 1.0 × 0.5 mm),实际器件尺寸约 1.15 × 0.65 × 1.00 mm,低剖面设计。产品响应故障电流迅速、初始电阻超低并且在动作后阻值显著增加以实现断开保护。符合 RoHS 要求,为无铅无卤配方,并可兼容高温焊料。

二、电气参数概况

  • 额定耐压(Vmax):6 V
  • 最大可承受故障电流(Imax):40 A(短时)
  • 保持电流(Ihold):100 mA(不动作条件下最大连续通过电流)
  • 跳闸电流(Itrip):300 mA(在规定时间内动作)
  • 动作时间:500 ms(达到跳闸电流时的典型动作时间)
  • 功耗(Pd):500 mW(功率耗散能力)
  • 初始态电阻(Rmin):150 mΩ(典型低阻值,降低电压降)
  • 跳断后最大阻值(R1max):2.8 Ω(恢复阻值范围,限制故障电流)

三、机械与环境规格

  • 工作温度范围:-40 ℃ 至 +85 ℃,适用于苛刻环境
  • 封装:0402(SMD)便于自动贴装,节省 PCB 面积
  • 低剖面:器件高度约 1.0 mm,适合厚度受限的移动设备和小型电子产品

四、典型应用场景

适用于需求短路/过流自恢复保护且空间受限的场景:

  • 电脑主板、笔记本电源保护、USB 电路保护
  • 手机与多媒体便携设备的电源/充电保护
  • 汽车电子(辅助电路)、工业控制模块、电话与宽带设备的过流防护

五、封装与焊接建议

  • 封装 0402,建议采用标准 0402 阵列的 PCB 焊盘布局并配合自动贴装工艺
  • 与高温焊料兼容,可承受常见回流焊工艺(请依据工艺资料确认峰值温度与时长)
  • 由于器件为低阻抗元件,焊接与母材的热阻和焊点质量会影响器件散热与可靠性,应保证良好焊点和合理铜箔面积

六、选型要点与注意事项

  • 选型时以保持电流 Ihold 和跳闸电流 Itrip 为核心,保证正常工作电流低于 Ihold 并留有裕量,故障时能在规定时间内动作。
  • 当系统可能出现短时大电流(高于 40 A)情况时,需额外评估器件的承受能力与安全性。
  • 考虑工作温度、散热条件及 PCB 布局对动作特性的影响,必要时进行样机验证以确认实际动作曲线与可靠性。

综上所述,BSMD0402L-010C 以超低初始电阻、快速故障响应和小尺寸低剖面为主要优势,适合对体积、成本和保护性能有较高要求的消费电子与工业应用。

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