WMSIC Electronic Components

BHFUSE BSMD0603-050-9V BSMD0603

ModelBSMD0603-050-9V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-050-9V
Type
BHFUSE
Minimum package
4000 编带

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-050-9V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.027g
Electronic Component
1.85mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0228072375
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
9V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-050-9V 自恢复保险丝(BSMD0603-050-9V,BHFUSE/佰宏)产品概述

一、产品简介

BSMD0603-050-9V 为佰宏(BHFUSE)出品的0603封装自恢复保险丝(聚合物正温度系数元件,PTC),适用于微型便携电子设备的过流保护与短路保护。器件体积小、响应快、可自恢复,有利于节省PCB面积并提升系统可靠性。

二、主要参数

  • 封装:0603(长 × 宽 × 高 = 1.85 mm × 1.05 mm × 1.15 mm)
  • 额定电压:Vmax = 9 V
  • 保持电流:Ihold = 500 mA(不触发时允许通过的最大稳定电流)
  • 跳闸电流:Itrip = 1 A(典型触发电流)
  • 最大冲击电流:Imax = 40 A(瞬态峰值能力)
  • 初始阻值:Rmin ≈ 100 mΩ
  • 跳断后阻值:R1max ≈ 800 mΩ
  • 动作时间:约 100 ms(在指定过流条件下)
  • 功耗:Pd = 500 mW
  • 工作温度范围:-40 ℃ ~ +85 ℃

三、性能特点

  • 小型化:0603封装方便在高密度PCB上应用。
  • 自恢复:异常电流消失后器件自动冷却恢复导通,减少更换成本。
  • 快速动作:典型动作时间约100 ms,可有效限制短路能量。
  • 宽温度范围:适用于工业级及消费类产品。
  • 良好瞬态承受力:可抵抗较高的浪涌电流(Imax=40 A),适合负载启动电流。

四、典型应用场景

  • 手机配件、小型充电器、移动电源及蓝牙耳机等便携设备的输入保护。
  • USB、I/O口和板级电源防护。
  • 低电压电源轨(≤9V)过流保护场合。

五、封装与布板建议

0603标准焊盘即可布局,建议将器件置于电源入口或保护回路靠近待保护器件处,配合旁路电容和合理的散热铜箔以帮助快速散热与恢复。注意焊盘尺寸与回流工艺匹配,避免过量焊膏导致热阻变化。

六、选型与使用建议

  • 确认工作电压≤9V;连续工作电流应低于Ihold(留有裕量通常取70%~80%)。
  • 若系统存在较大启动浪涌,应对比Imax与启动电流,并考虑并联或采用缓启动方案。
  • 在高环境温度下器件更易触发,需结合温升评估实际Ihold下降情况并做适当降额。

七、可靠性与测试建议

建议进行热阻、寿命测试与瞬态浪涌试验,验证在目标应用场景下的复位次数与阻值漂移(初始Rmin与触发后R1max)。同时关注焊接应力与包装运输环境对性能的影响。

使用时遵循datasheet具体曲线与测试条件,可获得长期稳定的过流保护效果。

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