WMSIC Electronic Components

BHFUSE BSMD0805-010-24V BSMD0805

ModelBSMD0805-010-24V
Package0805
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0805-010-24V
Type
BHFUSE
Minimum package
5000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0805-010-24V
Electronic Component
1
Electronic Component
1.5mm
Package
0805
Electronic Component
Resettable Fuse
Electronic Component
0.023g
Electronic Component
2.2mm
Electronic Component
0.9mm
Electronic Component
1
Electronic Component
1.5s
Electronic Component
BM0226603317
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
24V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0805-010-24V 自恢复保险丝(BHFUSE)产品概述

一、产品简介

BSMD0805-010-24V 是佰宏(BHFUSE)推出的一款0805 封装自恢复保险丝(PTC resettable fuse),用于对短路和过流情况提供自动限流保护。器件工作温度范围宽(-40℃ 至 +85℃),体积小、封装为标准 0805,适合表面贴装工艺,适用于便携设备、接口保护和电源线保护等场景。

二、主要技术参数

  • 封装:0805(SMD)
  • 尺寸:长度 2.2 mm × 宽度 1.5 mm × 高度 0.9 mm
  • 额定耐压(Vmax):24 V
  • 最大电流(Imax,冲击承受能力):40 A
  • 保持电流(Ihold):100 mA(器件在此电流下不动作)
  • 跳闸电流(Itrip):300 mA(典型触发电流)
  • 初始态阻值(Rmin):0.75 Ω(750 mΩ)
  • 跳断后阻值(R1max):6 Ω(动作后增大的阻值,用于限制电流)
  • 消耗功率 Pd:500 mW(热功耗能力)
  • 动作时间:1.5 s(在规定过流条件下达到跳闸)
  • 工作温度:-40℃ ~ +85℃

三、结构与封装尺寸

BSMD0805-010-24V 采用标准 0805 SMD 外形(2.2×1.5×0.9 mm),便于在有限空间内实现过流保护。器件与 PCB 的热耦合及焊盘设计会影响动作特性,建议遵循厂商推荐的焊盘尺寸与回流温度曲线以保证性能一致性。

四、性能特点

  • 小体积、易于贴装:0805 封装兼容自动贴片与回流焊工艺。
  • 自动复位:过流消除后阻值恢复,适合反复短路或暂态过流场合。
  • 快速动作:典型动作时间约 1.5 s,可在短路或过载出现时迅速限制电流。
  • 高冲击承受力:Imax 达到 40 A,能承受瞬态冲击电流(如上电浪涌)。
  • 宽温度范围:适合大多数消费与工业环境(-40℃ 至 +85℃)。

五、典型应用场景

  • USB/数据线及接口保护(Vbus 线路)
  • 便携电子设备的电源保护(移动电源、充电设备)
  • PCB 板级总线及外设供电保护
  • 工业控制与物联网终端的输入保护(要求工作电压 ≤24 V)

六、选型及注意事项

  • 电压选择:Vmax(24 V)应高于系统最大工作电压。
  • 电流匹配:正常工作电流应低于 Ihold(100 mA),否则器件可能产生不期望的加热或动作;短路或故障电流应能被 Itrip(≈300 mA)及时限制。
  • 热管理:Pd(500 mW)为器件允许的热耗散,实际应用应考虑环境温度与 PCB 散热对动作点的影响,必要时留有安全裕量。
  • 焊接与工艺:遵循制造商回流曲线,避免过高焊接温度和长时高温暴露以防特性漂移。
  • 环境与老化:长时间高温或频繁动作会改变器件阻值与动作电流,设计时应考虑寿命与维修策略。

七、可靠性与安装建议

为保证长期可靠性,应在 PCB 布局时为该元件提供适当的焊盘并避免紧邻高温元件,同时保持良好通风及散热路径。建议在样机阶段进行温升、反复动作及浪涌测试以验证在目标应用下的实际行为。对于关键安全线路,可考虑与传统慢断保险或限流电路配合使用以提高整体保护鲁棒性。

如需更详细的电流—时间曲线、热特性曲线或封装焊盘推荐,请提供样品需求或联系厂商获取完整数据手册。

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