WMSIC Electronic Components

BHFUSE BSMD0603-050-16V BSMD0603

ModelBSMD0603-050-16V
Package0603
BrandBHFUSE
Price Price on request Electronic component prices change quickly with market supply and demand. Please refer to the latest WMSIC quotation for current pricing.
Configuration
1 options
Configuration 26+

Available for RFQ

Technical data

Product details

19 specifications

Core information

Product name
BHFUSE BSMD0603-050-16V
Type
BHFUSE
Minimum package
4000 圆盘

Technical parameters

Electronic Component
Electronic Component
Electronic Component
BHFUSE
Electronic Component
BSMD0603-050-16V
Electronic Component
1
Electronic Component
1.05mm
Package
0603
Electronic Component
Resettable Fuse
Electronic Component
0.029g
Electronic Component
1.85mm
Electronic Component
1.15mm
Electronic Component
1
Electronic Component
100ms
Electronic Component
BM0226603342
Operating Temperature
40℃~+85℃
Voltage Rating(Vmax)
16V
Power(Pd)
500mW

For datasheets, package documents, compatible-part guidance, or other technical resources, contact WMSIC customer service. Availability is confirmed case by case.

BSMD0603-050-16V 产品概述

一、产品简介

BSMD0603-050-16V 是佰宏(BHFUSE)面向微型电子设备保护设计的 SMD 自恢复保险器件,采用 0603 小封装(尺寸见下)。器件在过流条件下能快速限流并恢复原始状态,适合对体积、重量和成本有严格要求的便携式与消费类电子产品的短路与过流保护。

二、主要电气参数

  • 额定耐压(Vmax):16 V
  • 最大瞬时电流(Imax):40 A(用于短时冲击,具体脉冲能力请参见厂商脉冲曲线)
  • 保持电流(Ihold):500 mA(在规定温度下可连续通过且不动作)
  • 跳闸电流(Itrip):1 A(达到此电流时在典型条件下动作)
  • 动作时间:约 100 ms(在达到 Itrip 时的典型动作响应)
  • 功耗(Pd):500 mW(热功耗能力)
  • 初始态阻值(Rmin):100 mΩ(正常工作时低电阻)
  • 跳断后阻值(R1max):800 mΩ(动作后显著增大,限制电流)

三、机械与环境条件

  • 尺寸:长 1.85 mm × 宽 1.05 mm × 高 1.15 mm(0603)
  • 工作温度范围:-40 ℃ ~ +85 ℃
  • 封装类型:0603 SMD,适配常见贴装和回流焊工艺

四、典型特性与工作原理

该器件为自恢复型(PPTC 类)保护元件:在正常工作电流下保持低阻值;当电流超过 Itrip 时,器件因自热而进入高阻态,限制电流并保护下游电路;故障解除并冷却后阻值恢复,便于重复使用。动作时间约 100 ms,适合响应一般短路与瞬态过流保护需求。

五、应用场景与电路建议

推荐用于 USB 接口保护、移动电源、电池管理辅助保护、便携式消费类设备、通信模块电源线等。选型时注意:

  • 工作电压不得超过 16 V;
  • 连续电流应低于 Ihold(500 mA),否则将产生热并可能触发跳闸;
  • 对于频繁的浪涌或长时间 高电流场景,应评估 Imax 的脉冲能力并做系统级降额设计;
  • PCB 布局上测试样机时尽量按最终产品的铜量与热环境验证,铜皮面积和散热条件会显著影响动作特性。

六、封装与焊接注意事项

  • 支持常规回流焊工艺,但建议按供应商的回流温度曲线和时间限制调整,以避免器件过热;
  • 贴装时避免器件受到过大的机械应力或弯折,应使用合适的吸嘴和回流工艺;
  • 推荐存储于干燥、常温环境,避免高温潮湿影响性能。

七、可靠性与测试

器件在出厂前一般经过电气性能筛选与温度循环测试。实际应用建议在最终系统环境下进行长期温升、过流触发与循环动作测试,以确认在目标温度和 PCB 散热条件下的稳定性和寿命。

八、选型与采购建议

品牌:BHFUSE(佰宏);型号:BSMD0603-050-16V;封装:0603。下单时请确认所需的包装形式(卷带/托盘)、工作/存储温度要求及是否需要额外的测试报告或样品。对于关键应用,建议先行少量样机验证后再批量采购。

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